JAJSII2A February   2020  – February 2020 ADS8355

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なブロック図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings
    3. 6.3      Recommended Operating Conditions
    4. 6.4      Thermal Information
    5. 6.5      Electrical Characteristics
    6. Table 1. Timing Requirements
    7. Table 2. Switching Characteristics
    8. 6.6      Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input: Full-Scale Range Selection
        2. 7.3.2.2 Analog Input: Single-Ended and Pseudo-Differential Configurations
      3. 7.3.3 Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Conversion Data Read: Dual-SDO Mode (Default)
      2. 7.4.2 Conversion Data Read: Single-SDO Mode
      3. 7.4.3 Low-Power Modes
        1. 7.4.3.1 STANDBY Mode
        2. 7.4.3.2 PD (Power-Down) Mode
    5. 7.5 Programming
      1. 7.5.1 Register Read/Write Operation
    6. 7.6 Register Map
      1. 7.6.1 ADS8355 Registers
        1. 7.6.1.1  PD_STANDBY Register (Offset = 4h) [reset = 0h]
          1. Table 9. PD_STANDBY Register Field Descriptions
        2. 7.6.1.2  PD_KEY Register (Offset = 5h) [reset = 0h]
          1. Table 10. PD_KEY Register Field Descriptions
        3. 7.6.1.3  SDO_CTRL Register (Offset = Dh) [reset = 0h]
          1. Table 11. SDO_CTRL Register Field Descriptions
        4. 7.6.1.4  DATA_OUT_CTRL Register (Offset = 11h) [reset = 0h]
          1. Table 12. DATA_OUT_CTRL Register Field Descriptions
        5. 7.6.1.5  REF_SEL Register (Offset = 20h) [reset = 0h]
          1. Table 13. REF_SEL Register Field Descriptions
        6. 7.6.1.6  REFDAC_A_LSB Register (Offset = 24h) [reset = 0h]
          1. Table 14. REFDAC_A_LSB Register Field Descriptions
        7. 7.6.1.7  REFDAC_A_MSB Register (Offset = 25h) [reset = 0h]
          1. Table 15. REFDAC_A_MSB Register Field Descriptions
        8. 7.6.1.8  REFDAC_B_LSB Register (Offset = 26h) [reset = 0h]
          1. Table 16. REFDAC_B_LSB Register Field Descriptions
        9. 7.6.1.9  REFDAC_B_MSB Register (Offset = 27h) [reset = 0h]
          1. Table 17. REFDAC_B_MSB Register Field Descriptions
        10. 7.6.1.10 INPUT_CONFIG Register (Offset = 28h) [reset = 0h]
          1. Table 18. INPUT_CONFIG Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Amplifier Selection
      2. 8.1.2 Charge Kickback Filter
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 開発サポート
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

Figure 48 provides a board layout example for the device WQFN package. Partition the printed circuit board (PCB) into analog and digital sections. Avoid crossing digital lines with the analog signal path and keep the analog input signals and the reference input signals away from noise sources. As illustrated in Figure 48, the analog input and reference signals are routed on the left side of the board and the digital connections are routed on the right side of the device.

The power sources to the device must be clean and well-bypassed. Use 10-µF, ceramic bypass capacitors in close proximity to the analog (AVDD) and digital (DVDD) power-supply pins. Avoid placing vias between the AVDD and DVDD pins and the bypass capacitors. Connect all ground pins to the ground plane using short, low impedance paths.

The REFIO_A and REFIO_B reference inputs and outputs are bypassed with 10-µF, X7R-grade, 0805-size, 16-V rated ceramic capacitors (CREF_x). Place the reference bypass capacitors as close as possible to the reference REFIO_x pins and connect the bypass capacitors using short, low-inductance connections. Avoid placing vias between the REFIO_x pins and the bypass capacitors.

The fly-wheel RC filters are placed immediately next to the input pins. Among ceramic surface-mount capacitors, COG (NPO) ceramic capacitors provide the best capacitance precision. The type of dielectric used in COG (NPO) ceramic capacitors provides the most stable electrical properties over voltage, frequency, and temperature changes.