JAJSL87H january   2010  – april 2021 BQ24090 , BQ24091 , BQ24092 , BQ24093 , BQ24095

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. 概要 (続き)
  7. Device Options
  8. Pin Configuration and Functions
  9. Specifications
    1. 8.1 Absolute Maximum Ratings #GUID-9FC6FB05-10A6-4323-9A52-EE32AE4C5F67/SLUS9405873
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions #GUID-4D70561B-CB71-403D-B731-8EF5DEBEBDF9/SLUS9401392
    4. 8.4 Thermal Information
    5. 8.5 Dissipation Ratings #GUID-196940BE-C3C2-4CDF-A8A4-7C186292F803/SLUS9404025 #GUID-196940BE-C3C2-4CDF-A8A4-7C186292F803/SLUS9403553
    6. 8.6 Electrical Characteristics
    7. 8.7 Typical Characteristics
      1. 8.7.1 Power Up, Power Down, OVP, Disable and Enable Waveforms
      2. 8.7.2 Protection Circuits Waveforms
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power Down or Undervoltage Lockout (UVLO)
      2. 9.3.2  UVLO
      3. 9.3.3  Power Up
      4. 9.3.4  Sleep Mode
      5. 9.3.5  New Charge Cycle
      6. 9.3.6  Overvoltage Protection (OVP) – Continuously Monitored
      7. 9.3.7  Power Good Indication ( PG)
      8. 9.3.8  CHG Pin Indication
      9. 9.3.9  CHG and PG LED Pullup Source
      10. 9.3.10 IN-DPM (VIN-DPM or IN–DPM)
      11. 9.3.11 OUT
      12. 9.3.12 ISET
      13. 9.3.13 PRE_TERM – Precharge and Termination Programmable Threshold
      14. 9.3.14 ISET2
      15. 9.3.15 TS
    4. 9.4 Device Functional Modes
      1. 9.4.1 Termination and Timer Disable Mode (TTDM) - TS Pin High
      2. 9.4.2 Timers
      3. 9.4.3 Termination
      4. 9.4.4 Battery Detect Routine
      5. 9.4.5 Refresh Threshold
      6. 9.4.6 Starting a Charge on a Full Battery
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Calculations
          1. 10.2.2.1.1 Program the Fast Charge Current, ISET:
          2. 10.2.2.1.2 Program the Termination Current Threshold, ITERM:
          3. 10.2.2.1.3 TS Function
          4. 10.2.2.1.4 CHG and PG
        2. 10.2.2.2 Selecting IN and OUT Pin Capacitors
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
      1. 12.3.1 Leakage Current Effects on Battery Capacity
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 サード・パーティ製品に関する免責事項
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 サポート・リソース
    4. 13.4 Trademarks
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 用語集
  15.   Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the BQ2409x, with short trace runs to both IN, OUT and GND (thermal pad).

  • All low-current GND connections should be kept separate from the high-current charge or discharge paths from the battery. Use a single-point ground technique incorporating both the small signal ground path and the power ground path.
  • The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces
  • The BQ2409x family is packaged in a thermally enhanced MLP package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. It is best to use multiple 10mil vias in the power pad of the IC and in close proximity to conduct the heat to the bottom ground plane. The bottom ground place should avoid traces that “cut off” the thermal path. The thinner the PCB the less temperature rise. The EVM PCB has a thickness of 0.031 inches and uses 2 oz. (2.8 mil thick) copper on top and bottom, and is a good example of optimal thermal performance.