JAJSF16D march   2013  – september 2020 BQ51013B

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1.     Pin Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Details of a Qi Wireless Power System and BQ51013 Power Transfer Flow Diagrams
      2. 8.3.2  Dynamic Rectifier Control
      3. 8.3.3  Dynamic Efficiency Scaling
      4. 8.3.4  RILIM Calculations
      5. 8.3.5  Input Overvoltage
      6. 8.3.6  Adapter Enable Functionality and EN1/EN2 Control
      7. 8.3.7  End Power Transfer Packet (WPC Header 0x02)
      8. 8.3.8  Status Outputs
      9. 8.3.9  WPC Communication Scheme
      10. 8.3.10 Communication Modulator
      11. 8.3.11 Adaptive Communication Limit
      12. 8.3.12 Synchronous Rectification
      13. 8.3.13 Temperature Sense Resistor Network (TS)
      14. 8.3.14 3-State Driver Recommendations for the TS/CTRL Pin
      15. 8.3.15 Thermal Protection
      16. 8.3.16 WPC v1.2 Compliance – Foreign Object Detection
      17. 8.3.17 Receiver Coil Load-Line Analysis
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 BQ51013B Wireless Power Receiver Used as a Power Supply
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Using The BQ51013b as a Wireless Power Supply: (See )
          2. 9.2.1.2.2 Series and Parallel Resonant Capacitor Selection
          3. 9.2.1.2.3 Recommended RX Coils
          4. 9.2.1.2.4 COMM, CLAMP, and BOOT Capacitors
          5. 9.2.1.2.5 Control Pins and CHG
          6. 9.2.1.2.6 Current Limit and FOD
          7. 9.2.1.2.7 RECT and OUT Capacitance
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual Power Path: Wireless Power and DC Input
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Wireless and Direct Charging of a Li-Ion Battery at 800 mA
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 サード・パーティ製品に関する免責事項
      2. 12.1.2 Development Support
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

Pin Functions

PINI/ODESCRIPTION
NAMEYFPRHL
AC1B3, B42IAC input from receiver coil.
AC2B1, B219I
ADG49IIf AD functionality is used, connect this pin to the wired adapter input. When VAD-Pres is applied to this pin wireless charging is disabled and AD_EN is driven low. Connect a 1-µF capacitor from AD to PGND. If unused, the capacitor is not required and AD should be connected directly to PGND.
AD-ENF38OPush-pull driver for external PFET when wired charging is active. Float if not used.
BOOT1C43OBootstrap capacitors for driving the high-side FETs of the synchronous rectifier. Connect a 10-nF ceramic capacitor from BOOT1 to AC1 and from BOOT2 to AC2.
BOOT2C117O
CHGF47OOpen-drain output – active when OUT is enabled. Float or tie to PGND if unused.
CLAMP2E216OOpen-drain FETs which are used for a non-power dissipative overvoltage AC clamp protection. When the RECT voltage goes above 15 V, both switches will be turned on and the capacitors will act as a low impedance to protect the device from damage. If used, capacitors are used to connect CLAMP1 to AC1 and CLAMP2 to AC2. Recommended connections are 0.47-µF capacitors.
CLAMP1E35O
COMM1E46OOpen-drain outputs used to communicate with primary by varying reflected impedance. Connect a capacitor from COMM1 to AC1 and a capacitor from COMM2 to AC2 for capacitive load modulation. For resistive modulation connect COMM1 and COMM2 to RECT through a single resistor. See Section 8.3.10 for more information.
COMM2E115O
EN1G310IInputs that allow user to enable and disable wireless and wired charging <EN1 EN2>:
<00> Wireless charging is enabled unless AD voltage > VAD_Pres.
<01> Dynamic communication current limit disabled.
<10> AD-EN pulled low, wireless charging disabled.
<11> Wired and wireless charging disabled.
EN2G211I
FODF214IInput for the rectified power measurement. See Section 8.3.16 for details.
ILIMG112I/OProgramming pin for the over current limit. The total resistance from ILIM to GND (RILIM) sets the current limit. The schematic shown in Figure 9-1 illustrates the RILIM as R1 + RFOD. Details can be found in Section 7.5 and Figure 9-1.
OUTD1, D2, D3, D44OOutput pin, delivers power to the load.
PGNDA1, A2, A3, A41, 20Power ground
RECTC2, C318OFilter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND. Depending on the power levels, the value may be 4.7 μF to 22 μF.
TS/CTRLF113IDual function pin: Temperature Sense (TS) and Control (CTRL) pin functionality.
For the TS functionality connect TS/CTRL to ground through a Negative Temperature Coefficient (NTC) resistor. If an NTC function is not desired, connect to PGND with a 10-kΩ resistor. See Section 8.3.13 for more details.
For the CTRL functionality pull below VCTRL-Low or pull above VCTRL-High to send an End Power Transfer Packet. See Table 8-4 for more details.
——PAD—The exposed thermal pad should be connected to ground (PGND)