JAJSI55C November   2015  – October 2019 DS280BR810

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     概略回路図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics -- Serial Management Bus Interface
    7. 6.7 Timing Requirements -- Serial Management Bus Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Data Path Operation
      2. 7.3.2 AC-Coupled Receiver and Transmitter
      3. 7.3.3 Signal Detect
      4. 7.3.4 2-Stage CTLE
      5. 7.3.5 Driver DC Gain Control
      6. 7.3.6 FIR Filter (Limiting Mode)
      7. 7.3.7 Configurable SMBus Address
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Slave Mode Configuration
      2. 7.4.2 SMBus Master Mode Configuration (EEPROM Self Load)
    5. 7.5 Programming
      1. 7.5.1 Transfer of Data with the SMBus Interface
    6. 7.6 Register Maps
      1. 7.6.1 Register Types: Global, Shared, and Channel
      2. 7.6.2 Global Registers: Channel Selection and ID Information
        1. Table 2. Global Register Map
      3. 7.6.3 Shared Registers
        1. Table 3. Shared Register Map
      4. 7.6.4 Channel Registers
        1. Table 4. Channel Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Backplane and Mid-Plane Reach Extension
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Front-Port Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連文書
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

The following guidelines should be followed when designing the layout:

  1. Decoupling capacitors should be placed as close to the VDD pins as possible. Placing them directly underneath the device is one option if the board design permits.
  2. High-speed differential signals should be tightly coupled, skew matched, and impedance controlled.
  3. Vias should be avoided when possible on the high-speed differential signals. When vias must be used, care should be taken to minimize the via stub, either by transitioning through most or all layers, or by back drilling.
  4. GND relief can be used beneath the high-speed differential signal pads to improve signal integrity by counteracting the pad capacitance.
  5. GND vias should be placed directly beneath the device connecting the GND plane attached to the device to the GND planes on other layers. This has the added benefit of improving thermal conductivity from the device to the board.
  6. BGA landing pads for a 0.8 mm pitch flip-chip BGA are typically 0.4 mm in diameter (exposed). The actual size of the copper pad will depend on whether solder-mask-defined (SMD) or non-solder-mask-defined solder land pads are used. For more information, refer to TI’s Surface Mount Technology (SMT) References website.