SBOS206F January   2001  – October 2023 OPA561

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Adjustable Current Limit
        1. 6.2.1.1 Current Limit Accuracy
        2. 6.2.1.2 Setting the Current Limit
      2. 6.2.2 Enable-Status (E/S) Pin
        1. 6.2.2.1 Output Disable
        2. 6.2.2.2 Maintaining Microcontroller Compatibility
      3. 6.2.3 Overcurrent Flag
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Output Stage Compensation
      2. 7.1.2 Output Protection
      3. 7.1.3 Thermal Protection
      4. 7.1.4 Power Dissipation
      5. 7.1.5 Heat-Sink Area
      6. 7.1.6 Amplifier Mounting
        1. 7.1.6.1 What is the PowerPAD™ Integrated Circuit Package?
        2. 7.1.6.2 PowerPAD™ Integrated Circuit Package Assembly Process
    2. 7.2 Typical Application
      1. 7.2.1 Laser Diode Driver
      2. 7.2.2 Programmable Power Supply
      3. 7.2.3 Power-Line Communication Modem
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • PWP|20
サーマルパッド・メカニカル・データ
発注情報

Heat-Sink Area

The relationship between thermal resistance and power dissipation can be expressed as:

Equation 2. θ J A = T J T A P D

Where:

  • TJ = Junction temperature (°C)
  • TA = Ambient temperature (°C)
  • θJA = Junction-to-ambient thermal resistance (°C/W)
  • PD = Power dissipation (W)
Calculate the appropriate power dissipation to determine required heat-sink area. At the same time, consider the relationship between power dissipation and thermal resistance to minimize shutdown conditions and allow for proper long-term operation (junction temperature of 125 °C). After the heat-sink area has been selected, verify proper thermal protection by testing worst-case load conditions. For applications with limited board size, refer to Figure 7-3 for the approximate thermal resistance relative to heat-sink area. Increasing heat-sink area beyond 2 in2 provides little improvement in thermal resistance. To achieve the 32 °C/W stated in the Electrical Characteristics, a copper plane size of 9 in2 was used. The HTSSOP-20 PowerPAD integrated circuit package is a good choice for continuous power levels from 2 W to 4 W, depending on ambient temperature and heat-sink area. Higher power levels can be achieved in applications with a low on-off duty cycle, such as remote meter reading.

GUID-20230614-SS0I-G3K3-WQHL-SRRSB210KQZN-low.svg Figure 7-3 Thermal Resistance vs Circuit Board Copper Area