JAJSUI9P January   1993  – May 2024 SN74LVC10A

PRODUCTION DATA  

  1.   1
  2. 特長
  3. 概要
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • D|14
  • RGY|14
  • PW|14
  • DB|14
  • NS|14
サーマルパッド・メカニカル・データ
発注情報

Pin Configuration and Functions

SN74LVC10A SN74LVC10A D, DB, NS, or PW Packages; 14-Pin SOIC, SSOP, SOP, or
                        TSSOP (Top View)Figure 3-1 SN74LVC10A D, DB, NS, or PW Packages; 14-Pin SOIC, SSOP, SOP, or TSSOP (Top View)
SN74LVC10A SN74LVC10A BQA Package, 14-Pin WQFN (Top View)Figure 3-2 SN74LVC10A BQA Package, 14-Pin WQFN (Top View)
Table 3-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
1A 1 Input Channel 1, Input A
1B 2 Input Channel 1, Input B
2A 3 Input Channel 2, Input A
2B 4 Input Channel 2, Input B
2C 5 Input Channel 2, Input C
2Y 6 Output Channel 2, Output Y
GND 7 Ground
3Y 8 Output Channel 3, Output Y
3A 9 Input Channel 3, Input A
3B 10 Input Channel 3, Input B
3C 11 Input Channel 3, Input C
1Y 12 Output Channel 1, Output Y
1C 13 Input Channel 1, Input C
VCC 14 Positive Supply
Thermal pad Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance.
I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable