SLOS739A July   2012  – March 2016 TAS5721

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - I/O Pin Characteristics
    6. 7.6  Master Clock Characteristics
    7. 7.7  Speaker Amplifier Characteristics
    8. 7.8  Headphone Amplifier and Line Driver Characteristics
    9. 7.9  Protection Characteristics
    10. 7.10 I2C Serial Control Port Requirements and Specifications
    11. 7.11 Serial Audio Port Timing
    12. 7.12 Typical Characteristics
      1. 7.12.1 Headphone Typical Characteristics
      2. 7.12.2 Line Driver Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power Supply
      2. 9.3.2  I2C Address Selection and Fault Output
      3. 9.3.3  Device Protection System
        1. 9.3.3.1 Overcurrent (OC) Protection With Current Limiting
        2. 9.3.3.2 Overtemperature Protection
        3. 9.3.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
      4. 9.3.4  Clock, Auto Detection, and PLL
      5. 9.3.5  PWM Section
      6. 9.3.6  SSTIMER Functionality
      7. 9.3.7  2.1-Mode Support
        1. 9.3.7.1 Supply Pumping and Polarity Inversion for 2.1 Mode
      8. 9.3.8  PBTL-Mode Support
      9. 9.3.9  I2C Serial Control Interface
        1. 9.3.9.1 Single- and Multiple-Byte Transfers
        2. 9.3.9.2 Single-Byte Write
        3. 9.3.9.3 Multiple-Byte Write
        4. 9.3.9.4 Single-Byte Read
        5. 9.3.9.5 Multiple-Byte Read
      10. 9.3.10 Dynamic Range Control (DRC)
      11. 9.3.11 Bank Switching
      12. 9.3.12 Serial Data Interface
        1. 9.3.12.1 Serial Interface Control and Timing
          1. 9.3.12.1.1 I2S Timing
          2. 9.3.12.1.2 Left-Justified
          3. 9.3.12.1.3 Right-Justified
      13. 9.3.13 DirectPath Headphone/Line Driver
        1. 9.3.13.1 Using Headphone Amplifier in TAS5721
        2. 9.3.13.2 Using Line Driver Amplifier in TAS5721
    4. 9.4 Device Functional Modes
      1. 9.4.1 Output Mode and MUX Selection
    5. 9.5 Programming
      1. 9.5.1 General I2C Operation
        1. 9.5.1.1 I2C Device Address Change Procedure
      2. 9.5.2 26-Bit 3.23 Number Format
    6. 9.6 Register Maps
      1. 9.6.1  Clock Control Register (0x00)
      2. 9.6.2  Device ID Register (0x01)
      3. 9.6.3  Error Status Register (0x02)
      4. 9.6.4  System Control Register 1 (0x03)
      5. 9.6.5  Serial Data Interface Register (0x04)
      6. 9.6.6  System Control Register 2 (0x05)
      7. 9.6.7  Soft Mute Register (0x06)
      8. 9.6.8  Volume Registers (0x07, 0x08, 0x09, 0x0A)
      9. 9.6.9  Volume Configuration Register (0x0E)
      10. 9.6.10 Modulation Limit Register (0x10)
      11. 9.6.11 Interchannel Delay Registers (0x11, 0x12, 0x13, and 0x14)
      12. 9.6.12 Pwm Shutdown Group Register (0x19)
      13. 9.6.13 Start/stop Period Register (0x1A)
      14. 9.6.14 Oscillator Trim Register (0x1B)
      15. 9.6.15 BKND_ERR Register (0x1C)
      16. 9.6.16 Input Multiplexer Register (0x20)
      17. 9.6.17 Channel 4 Source Select Register (0x21)
      18. 9.6.18 PWM Output MUX Register (0x25)
      19. 9.6.19 DRC Control (0x46)
      20. 9.6.20 Bank Switch and EQ Control (0x50)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Component Selection and Hardware Connections
        2. 10.2.2.2 I2C Pullup Resistors
        3. 10.2.2.3 Digital I/O Connectivity
        4. 10.2.2.4 Recommended Startup and Shutdown Procedures
          1. 10.2.2.4.1 Recommended Use Model
            1. 10.2.2.4.1.1 Initialization Sequence
            2. 10.2.2.4.1.2 Normal Operation
            3. 10.2.2.4.1.3 Shutdown Sequence
            4. 10.2.2.4.1.4 Power-Down Sequence
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
    1. 11.1 DVDD and AVDD Supplies
    2. 11.2 PVDD Power Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted). (1)
MIN MAX UNIT
Supply voltage DVDD, AVDD, DRVDD –0.3 3.6 V
PVDD –0.3 30 V
DR_INx –0.3 DRVDD + 6 V
Input voltage 3.3-V digital input –0.5 DVDD + 0.5 V
5-V tolerant(2) digital input (except MCLK) –0.5 DVDD + 2.5(4)
5-V tolerant MCLK input –0.5 AVDD + 2.5(4)
SPK_OUTx to GND 32(3) V
BSTRPx to GND 39(3) V
Operating free-air temperature 0 85 °C
Storage temperature, Tstg –40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability.
(2) 5-V tolerant inputs are PDN, RST, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL.
(3) DC voltage + peak AC waveform measured at the pin should be below the allowed limit for all conditions.
(4) Maximum pin voltage should not exceed 6 V.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT
xVDD Digital, analog, headphone supply voltage 3 3.3 3.6 V
PVDD Half-bridge supply voltage 8 26.4(1) V
VIH High-level input voltage 5-V tolerant 2 V
VIL Low-level input voltage 5-V tolerant 0.8 V
TA Operating ambient temperature 0 85 °C
TJ (2) Operating junction temperature 0 125 °C
RSPK
(SE, BTL, and PBTL)		 Minimum supported speaker impedance Output filter: L = 15 μH, C = 330 nF 4 8 Ω
Lo(BTL) Output-filter inductance Minimum output inductance
under short-circuit condition		 10 μH
RHP Headphone mode load impedance 16 32 Ω
RLD Line-diver mode load impedance 0.6 10 kΩ
(1) For operation at PVDD levels greater than 18 V, the modulation limit must be set to 93.8% via the control port register 0x10.
(2) Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device.

7.4 Thermal Information

THERMAL METRIC(1) TAS5721 UNIT
DCA (HTSSOP)
48 PINS
RθJA Junction-to-ambient thermal resistance 27.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.7 °C/W
RθJB Junction-to-board thermal resistance 13 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 6.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics – I/O Pin Characteristics

PVDD = 18 V, AVDD = DRVDD = DVDD = 3.3 V, external components per Typical Application diagrams, and in accordance with recommended operating conditions (unless otherwise specified).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage ADR/FAULT and SDA IOH = –4 mA
DVDD = AVDD = 3 V		 2.4 V
VOL Low-level output voltage IOL = 4 mA
DVDD = AVDD = 3 V		 0.5
IIL Low-level input current Digital Inputs VI < VIL ; DVDD = AVDD = 3.6 V
 75 μA
IIH High-level input current VI > VIH ; DVDD = AVDD = 3.6 V
 75
IDD 3.3 V supply current 3.3 V supply voltage (DVDD, AVDD) Normal mode 48 70 mA
Reset (RST = low, PDN = high, DR_SD = low) 21 38
tw(RST) Pulse duration, RST active RST 100 μs
td(I2C_ready) Time before the I2C port is able communicate after RST goes high 12 ms

7.6 Master Clock Characteristics(1)

PVDD = 18 V, AVDD = DRVDD = DVDD = 3.3 V, external components per Typical Application diagrams, and in accordance with recommended operating conditions (unless otherwise specified).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fMCLK MCLK frequency 2.8224 24.576 MHz
MCLK duty cycle 40% 50% 60%
tr(MCLK) / tf(MCLK) Rise/fall time for MCLK 5 ns
(1) For clocks related to the serial audio port, please see Serial Audio Port Timing

7.7 Speaker Amplifier Characteristics

TA = 25°C, PVDD = 18 V, AVDD = DRVDD = DVDD = 3.3 V, audio input signal =1 kHz sine wave, BTL, AD mode, fS = 48 kHz, RSPK = 8 Ω, AES17 filter, fPWM = 384 kHz, external components per Typical Application diagrams, and in accordance with recommended operating conditions (unless otherwise specified).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PoSPK (BTL) Power output per channel of speaker amplifier when used in BTL mode (2) PVDD = 18 V, RSPK = 8Ω, 1-kHz input signal 10 W
PVDD = 12 V, RSPK = 8Ω, 10% THD+N, 1-kHz input signal 8.8
PVDD = 12 V, RSPK = 8Ω, 7% THD+N, 1-kHz input signal 8.3
PVDD = 8 V, RSPK = 8Ω, 10% THD+N, 1-kHz input signal 4
PVDD = 8 V, RSPK = 8Ω, 7% THD+N, 1-kHz input signal 3.8
PoSPK (PBTL) Power output per channel of speaker amplifier when used in PBTL mode (2) PVDD = 12 V, RSPK = 4Ω,
10% THD+N, 1-kHz input signal		 10 W
PVDD = 12 V, RSPK = 4Ω,
7% THD+N, 1-kHz input signal		 10
PVDD = 18 V, RSPK = 4Ω,
1-kHz input signal		 10
PoSPK (SE) Power output per channel of speaker amplifier when used in SE mode (2) PVDD = 12 V, RSPK = 4 Ω,
10% THD+N, 1-kHz input signal		 4.3 W
PVDD = 24 V, RSPK = 4 Ω,
10% THD+N, 1-kHz input signal		 5.5
THD+N Total harmonic distortion + noise PVDD = 18 V, PO = 1 W 0.07%
PVDD = 12 V, PO = 1 W 0.11%
PVDD = 8 V, PO = 1 W 0.2%
ICN Idle channel noise A-weighted 61 μV
Crosstalk PO = 1 W, f = 1 kHz (BD Mode), PVDD = 24 V 58 dB
PO =1 W, f = 1 kHz (AD Mode), PVDD = 24 V 48 dB
SNR Signal-to-noise ratio(1) A-weighted, f = 1 kHz, maximum power at THD < 1% 106 dB
fPWM Output switching frequency 11.025/22.05/44.1-kHz data rate ±2% 352.8 kHz
48/24/12/8/16/32-kHz data rate ±2% 384
IPVDD Supply current No load (PVDD) Normal mode 32 50 mA
Reset (RST = low, PDN = high) 5 8
rDS(on) Drain-to-source resistance (for each of the Low-Side and High-Side Devices) TJ = 25°C, includes metallization resistance 200 mΩ
RPD Internal pulldown resistor at the output of each half-bridge Connected when drivers are in the high-impedance state to provide bootstrap capacitor charge. 3 kΩ
(1) SNR is calculated relative to 0-dBFS input level.
(2) Power levels are thermally limited.

7.8 Headphone Amplifier and Line Driver Characteristics

TA = 25°C, PVDD = 18 V, AVDD = DRVDD = DVDD = 3.3 V, audio input signal =1 kHz sine wave, BTL, AD mode, fS = 48 kHz, RSPK = 8 Ω, AES17 filter, fPWM = 384 kHz, external components per Typical Application diagrams, and in accordance with recommended operating conditions (unless otherwise specified).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PoHP Power output per channel of headphone amplifier DRVDD = 3.3 V (RHP = 32; THD = 1%) 50 mW
AVDR Gain for headphone amplifier and line driver Adjustable through Rin and Rfb - dB
SNRHP Signal-to-noise ratio (headphone mode) Rhp = 32 101 dB
SNRLD Signal-to-noise ratio (line driver mode) 2-VRMS output 105 dB

7.9 Protection Characteristics

TA = 25°C, PVDD = 18 V, AVDD = DRVDD = DVDD = 3.3 V, audio input signal =1 kHz sine wave, BTL, AD mode, fS = 48 kHz, RSPK = 8 Ω, AES17 filter, fPWM = 384 kHz, external components per Typical Application diagrams, and in accordance with recommended operating conditions (unless otherwise specified).
MIN TYP MAX UNIT
Vuvp(fall) Undervoltage protection limit PVDD falling 4 V
Vuvp(rise) Undervoltage protection limit PVDD rising 4.1 V
OTE Overtemperature error threshold 150 °C
ΔOTE Variation in overtemperature detection circuit ±15 °C
IOCE Overcurrent limit protection threshold 3 A
tOCE Overcurrent response time 150 ns

7.10 I2C Serial Control Port Requirements and Specifications

PVDD = 18 V, AVDD = DRVDD = DVDD = 3.3 V, external components per Typical Application diagrams, and in accordance with recommended operating conditions (unless otherwise specified).
MIN MAX UNIT
fSCL Frequency, SCL No wait states 400 kHz
tw(H) Pulse duration, SCL high 0.6 μs
tw(L) Pulse duration, SCL low 1.3 μs
tr Rise time, SCL and SDA 300 ns
tf Fall time, SCL and SDA 300 ns
tsu1 Setup time, SDA to SCL 100 ns
th1 Hold time, SCL to SDA 0 ns
t(buf) Bus free time between stop and start conditions 1.3 μs
tsu2 Setup time, SCL to start condition 0.6 μs
th2 Hold time, start condition to SCL 0.6 μs
tsu3 Setup time, SCL to stop condition 0.6 μs
CL Load capacitance for each bus line 400 pF

7.11 Serial Audio Port Timing

PVDD = 18 V, AVDD = DRVDD = DVDD = 3.3 V, audio input signal =1 kHz sine wave, BTL, AD mode, fS = 48 kHz, RSPK = 8 Ω, AES17 filter, fPWM = 384 kHz, external components per Typical Application diagrams, and in accordance with recommended operating conditions (unless otherwise specified).
MIN TYP MAX UNIT
fSCLKIN Frequency, SCLK 32 × fS, 48 × fS, 64 × fS CL = 30 pF 1.024 12.288 MHz
tsu1 Setup time, LRCLK to SCLK rising edge 10 ns
th1 Hold time, LRCLK from SCLK rising edge 10 ns
tsu2 Setup time, SDIN to SCLK rising edge 10 ns
th2 Hold time, SDIN from SCLK rising edge 10 ns
LRCLK frequency 8 48 48 kHz
SCLK duty cycle 40% 50% 60%
LRCLK duty cycle 40% 50% 60%
SCLK rising edges between LRCLK rising edges 32 64 SCLK edges
t(edge) LRCLK clock edge with respect to the falling edge of SCLK –1/4 1/4 SCLK period
tr/tf Rise/fall time for SCLK/LRCLK 8 ns
LRCLK allowable drift before LRCLK reset 4 MCLK Periods
TAS5721 sys_init_tas5733.gif

NOTE:

On power up, it is recommended that the TAS5721 RST be held LOW for at least 100 μs after DVDD has reached 3 V.

NOTE:

If RST is asserted LOW while PDN is LOW, then RST must continue to be held LOW for at least 100 μs after PDN is deasserted (HIGH).
Figure 1. Reset Timing
TAS5721 t0027-01.gif Figure 2. SCL and SDA Timing
TAS5721 t0028-01.gif Figure 3. Start and Stop Conditions Timing
TAS5721 t0026-04_los556.gif Figure 4. Serial Audio Port Timing

7.12 Typical Characteristics

TAS5721 C002_SEPVDDvPo8Vto24V4R8R.png Figure 5. Output Power vs PVDD IN 2.1 Mode
TAS5721 G004_THDvFreq12V4R6R8R.png Figure 7. Total Harmonic Distortion + Noise vs Frequency in 2.0 Mode With PVDD = 12 V
TAS5721 G006_THDvFreq24V4R6R8R.png Figure 9. Total Harmonic Distortion + Noise vs Frequency in 2.0 Mode With PVDD = 24 V
TAS5721 G008_SETHDvFreq18V4R8R.png Figure 11. Total Harmonic Distortion + Noise vs Frequency in 2.1 Mode With PVDD = 18 V
TAS5721 G010_PBTLTHDvFreq12V4R6R8R.png Figure 13. Total Harmonic Distortion + Noise vs Frequency in PBTL Mode With PVDD = 12 V
TAS5721 G012_PBTLTHDvFreq24V4R6R8R.png Figure 15. Total Harmonic Distortion + Noise vs Frequency in PBTL Mode With PVDD = 24 V
TAS5721 G014_SEPVDDvICN8Vto24V4R8R.png Figure 17. 2.1 Idle Channel Noise vs PVDD
TAS5721 C016_THDvPo1kHz12V4R6R8R.png Figure 19. Total Harmonic Distortion + Noise vs Output Power in 2.0 Mode With PVDD = 12 V
TAS5721 C018_THDvPo1kHz24V4R6R8R.png Figure 21. Total Harmonic Distortion + Noise vs Output Power in 2.0 Mode With PVDD = 24 V
TAS5721 C020_SETHDvPo1kHz18V4R8R.png Figure 23. Total Harmonic Distortion + Noise vs Output Power in 2.1 Mode With PVDD = 18 V
TAS5721 C022_PBTLTHDvPo1kHz12V2R4R.png Figure 25. Total Harmonic Distortion + Noise vs Output Power in PBTL Mode With PVDD = 12 V
TAS5721 C024_PBTLTHDvPo1kHz24V2R4R.png Figure 27. Total Harmonic Distortion + Noise vs Output Power in PBTL Mode With PVDD = 24 V
TAS5721 G026_EffvPo12V18V24V8R8R8R.png
All channels driven
Figure 29. Efficiency vs Output Power in 2.1 Mode
TAS5721 G029_PBTLEffvPo12V18V24V8R.png
All channels driven
Figure 31. Efficiency vs Output Power in PBTL Mode
TAS5721 G032_XtalkvFreq12V4R.png Figure 33. Crosstalk vs Frequency in 2.0 Mode
TAS5721 G034_XtalkvFreq24V4R.png Figure 35. Crosstalk vs Frequency in 2.0 Mode
TAS5721 G036_SEXtalkvFreq12V8R.png Figure 37. Crosstalk vs Frequency in 2.1 Mode
TAS5721 G038_SEXtalkvFreq24V8R.png Figure 39. Crosstalk vs Frequency in 2.1 Mode
TAS5721 C003_PBTLPVDDvPo8Vto24V4R6R8R.png Figure 6. Output Power vs PVDD in PBTL Mode
TAS5721 G005_THDvFreq18V4R6R8R.png Figure 8. Total Harmonic Distortion + Noise vs Frequency in 2.0 Mode With PVDD = 18 V
TAS5721 G007_SETHDvFreq12V4R8R.png Figure 10. Total Harmonic Distortion + Noise vs Frequency in 2.1 Mode With PVDD = 12 V
TAS5721 G009_SETHDvFreq24V4R8R.png Figure 12. Total Harmonic Distortion + Noise vs Frequency in 2.1 Mode With PVDD = 24 V
TAS5721 G011_PBTLTHDvFreq18V4R6R8R.png Figure 14. Total Harmonic Distortion + Noise vs Frequency in PBTL Mode With PVDD = 18 V
TAS5721 G013_PVDDvICN8Vto24V4R6R8R.png Figure 16. 2.0 Idle Channel Noise vs PVDD
TAS5721 G015_PVDDvICN8Vto24V4R6R8R.png Figure 18. PBTL Idle Channel Noise vs PVDD
TAS5721 C017_THDvPo1kHz18V4R6R8R.png Figure 20. Total Harmonic Distortion + Noise vs Output Power in 2.0 Mode With PVDD = 18 V
TAS5721 C019_SETHDvPo1kHz12V4R8R.png Figure 22. Total Harmonic Distortion + Noise vs Output Power in 2.1 Mode With PVDD = 12 V
TAS5721 C021_SETHDvPo1kHz24V4R8R.png Figure 24. Total Harmonic Distortion + Noise vs Output Power in 2.1 Mode With PVDD = 24 V
TAS5721 C023_PBTLTHDvPo1kHz18V2R4R.png Figure 26. Total Harmonic Distortion + Noise vs Output Power in PBTL Mode With PVDD = 18 V
TAS5721 G025_EffvPo12V18V24V8R.png
All channels driven
Figure 28. Efficiency vs Output Power in 2.0 Mode
TAS5721 G027_EffvPo12V18V24V4R4R8R.png
All channels driven
Figure 30. Efficiency vs Output Power in 2.1 Mode
TAS5721 G030_PBTLEffvPo12V18V24V6R.png
All channels driven
Figure 32. Efficiency vs Output Power in PBTL Mode
TAS5721 G033_XtalkvFreq12V8R.png Figure 34. Crosstalk vs Frequency in 2.0 Mode
TAS5721 G035_XtalkvFreq24V8R.png Figure 36. Crosstalk vs Frequency in 2.0 Mode
TAS5721 G037_SEXtalkvFreq12V4R.png Figure 38. Crosstalk vs Frequency in 2.1 Mode
TAS5721 G039_SEXtalkvFreq24V4R.png Figure 40. Crosstalk vs Frequency in 2.1 Mode

7.12.1 Headphone Typical Characteristics

TAS5721 G040_HPTHDvFreq3p3V16R32R.png Figure 41. Total Harmonic Distortion + Noise vs Frequency Headphone With DRVDD = 3.3 V
TAS5721 G042_HPTHDvPo1kHz3p3V16R32R.png Figure 43. Total Harmonic Distortion + Noise vs Output Power Headphone With DRVDD = 3.3 V
TAS5721 G041_HPTHDvFreq3p3V5kR10kR.png Figure 42. Total Harmonic Distortion + Noise vs Frequency Headphone With DRVDD = 3.3 V

7.12.2 Line Driver Typical Characteristics

TAS5721 G043_HPTHDvVo1kHz3p3V5kR10kR.png Figure 44. Total Harmonic Distortion + Noise vs Output Voltage Headphone With DRVDD = 3.3 V
TAS5721 G045_HPXtalkvFreq3p3V16R.png Figure 46. Crosstalk vs Frequency Headphone With DRVDD = 3.3 V
TAS5721 G044_HPXtalkvFreq3p3V5kR.png Figure 45. Crosstalk vs Frequency Headphone With DRVDD = 3.3 V
TAS5721 G046_HPXtalkvFreq3p3V32R.png Figure 47. Crosstalk vs Frequency Headphone With DRVDD = 3.3 V