JAJSI95 December   2019 TL16C750E

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     ブロック図
  4. 4 改訂履歴
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. Table 1. Absolute Maximum Ratings
    2. 7.1      ESD Ratings
    3. Table 2. Recommended Operating Conditions
    4. Table 3. Thermal Information
    5. Table 4. Electrical Characteristics
    6. Table 5. Timing Requirements
    7. 7.2      Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  UART Modes
      2. 9.3.2  Trigger Levels
      3. 9.3.3  Hardware Flow Control
      4. 9.3.4  Auto-RTS
      5. 9.3.5  Auto-CTS
      6. 9.3.6  Software Flow Control
      7. 9.3.7  Software Flow Control Example
      8. 9.3.8  Reset
      9. 9.3.9  Interrupts
      10. 9.3.10 Interrupt Mode Operation
      11. 9.3.11 Polled Mode Operation
      12. 9.3.12 Break and Timeout Conditions
      13. 9.3.13 Programmable Baud Rate Generator with Fractional Divisor
      14. 9.3.14 Fractional Divisor
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Interface Mode
        1. 9.4.1.1 IOR Used (MODE = VCC)
        2. 9.4.1.2 IOR Unused (MODE = GND)
      2. 9.4.2 DMA Signaling
        1. 9.4.2.1 Single DMA Transfers (DMA Mode 0 or FIFO Disable)
        2. 9.4.2.2 Block DMA Transfers (DMA Mode 1)
      3. 9.4.3 Sleep Mode
    5. 9.5 Register Maps
      1. 9.5.1  Registers Operations
      2. 9.5.2  Receiver Holding Register (RHR)
      3. 9.5.3  Transmit Holding Register (THR)
      4. 9.5.4  FIFO Control Register (FCR)
      5. 9.5.5  Line Control Register (LCR)
      6. 9.5.6  Line Status Register (LSR)
      7. 9.5.7  Modem Control Register (MCR)
      8. 9.5.8  Modem Status Register (MSR)
      9. 9.5.9  Interrupt Enable Register (IER)
      10. 9.5.10 Interrupt Identification Register (IIR)
      11. 9.5.11 Enhanced Feature Register (EFR)
      12. 9.5.12 Divisor Latches (DLL, DLH, DLF)
      13. 9.5.13 Transmission Control Register (TCR)
      14. 9.5.14 Trigger Level Register (TLR)
      15. 9.5.15 FIFO Ready Register
      16. 9.5.16 Alternate Function Register (AFR)
      17. 9.5.17 RS-485 Mode
      18. 9.5.18 IrDA Overview
      19. 9.5.19 IrDA Encoder Function
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Set the desired baud rate
        2. 10.2.2.2 Reset the fifos
        3. 10.2.2.3 Sending data on the bus
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
      1. 13.1.1 関連資料
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 サポート・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.1 Layout Guidelines

Traces, Vias, and Other PCB Components: A right angle in a trace can cause more radiation. The capacitance increases in the region of the corner, and the characteristic impedance changes. This impedance change causes reflections.

  • Avoid right-angle bends in a trace and try to route them at least with two 45° corners. To minimize any impedance change, the best routing would be a round bend (see Figure 28).
  • Separate high-speed signals (for example, clock signals) from low-speed signals and digital from analog signals; again, placement is important.
  • To minimize crosstalk not only between two signals on one layer but also between adjacent layers, route them with 90° to each other
Figure 46. Layout Do's and Don'ts