SPRS565D April   2009  – June 2014 TMS320C6743

PRODUCTION DATA.  

  1. 1TMS320C6743 Fixed- and Floating-Point Digital Signal Processor
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Overview
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 DSP Subsystem
      1. 3.3.1 C674x DSP CPU Description
      2. 3.3.2 DSP Memory Mapping
        1. 3.3.2.1 External Memories
        2. 3.3.2.2 DSP Internal Memories
        3. 3.3.2.3 C674x CPU
    4. 3.4 Memory Map Summary
      1. 3.4.1 C6743 Top Level Memory Map
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Terminal Functions
      1. 3.6.1  Device Reset and JTAG
      2. 3.6.2  High-Frequency Oscillator and PLL
      3. 3.6.3  External Memory Interface A (ASYNC)
      4. 3.6.4  External Memory Interface B (SDRAM only)
      5. 3.6.5  Serial Peripheral Interface Modules (SPI0)
      6. 3.6.6  Enhanced Capture/Auxiliary PWM Modules (eCAP0, eCAP1, eCAP2)
      7. 3.6.7  Enhanced Pulse Width Modulators (eHRPWM0, eHRPWM1, eHRPWM2)
      8. 3.6.8  Enhanced Quadrature Encoder Pulse Module (eQEP)
      9. 3.6.9  Boot
      10. 3.6.10 Universal Asynchronous Receiver/Transmitters (UART0, UART2)
      11. 3.6.11 Inter-Integrated Circuit Modules (I2C0, I2C1)
      12. 3.6.12 Timers
      13. 3.6.13 Multichannel Audio Serial Ports (McASP0, McASP1)
      14. 3.6.14 Ethernet Media Access Controller (EMAC)
      15. 3.6.15 Multimedia Card/Secure Digital (MMC/SD)
      16. 3.6.16 General-Purpose IO Only Terminal Functions
      17. 3.6.17 Reserved and No Connect Terminal Functions
      18. 3.6.18 Supply and Ground Terminal Functions
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Device Operating Conditions
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 PLL Controller 0 Registers
    7. 6.7  DSP Interrupts
    8. 6.8  General-Purpose Input/Output (GPIO)
      1. 6.8.1 GPIO Register Description(s)
      2. 6.8.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-10 Timing Requirements for GPIO Inputs (see )
        2. Table 6-11 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.8.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-12 Timing Requirements for External Interrupts (see )
    9. 6.9  EDMA
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Connection Examples
      3. 6.10.3 External Memory Interface (EMIF) Registers
      4. 6.10.4 EMIFA Electrical Data/Timing
        1. Table 6-19 EMIFA Asynchronous Memory Timing Requirements
        2. Table 6-20 EMIFA Asynchronous Memory Switching Characteristics
    11. 6.11 External Memory Interface B (EMIFB)
      1. 6.11.1 EMIFB SDRAM Loading Limitations
      2. 6.11.2 Interfacing to SDRAM
      3. 6.11.3 EMIFB Electrical Data/Timing
        1. Table 6-24 EMIFB SDRAM Interface Timing Requirements
        2. Table 6-25 EMIFB SDRAM Interface Switching Characteristics
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD)
      1. 6.13.1 MMCSD Peripheral Register Description(s)
      2. 6.13.2 MMC/SD Electrical Data/Timing
        1. Table 6-29 Timing Requirements for MMC/SD Module (see and )
        2. Table 6-30 Switching Characteristics Over Recommended Operating Conditions for MMC/SD Module (see through )
    14. 6.14 Ethernet Media Access Controller (EMAC)
      1. 6.14.1 EMAC Peripheral Register Description(s)
      2. 6.14.2 EMAC Electrical Data/Timing
    15. 6.15 Management Data Input/Output (MDIO)
      1. 6.15.1 MDIO Peripheral Register Description(s)
      2. 6.15.2 Management Data Input/Output (MDIO) Electrical Data/Timing
        1. Table 6-38 Timing Requirements for MDIO Input (see and )
        2. Table 6-39 Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see )
    16. 6.16 Multichannel Audio Serial Ports (McASP0, McASP1)
      1. 6.16.1 McASP Peripheral Registers Description(s)
      2. 6.16.2 McASP Electrical Data/Timing
        1. 6.16.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-44 McASP0 Timing Requirements
          2. Table 6-45 McASP0 Switching Characteristics
        2. 6.16.2.2 Multichannel Audio Serial Port 1 (McASP1) Timing
          1. Table 6-46 McASP1 Timing Requirements
          2. Table 6-47 McASP1 Switching Characteristics
    17. 6.17 Serial Peripheral Interface Ports (SPI0)
      1. 6.17.1 SPI Peripheral Registers Description(s)
      2. 6.17.2 SPI Electrical Data/Timing
        1. 6.17.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-49 General Timing Requirements for SPI0 Master Modes
          2. Table 6-50 General Timing Requirements for SPI0 Slave Modes
          3. Table 6-51 Additional SPI0 Master Timings, 4-Pin Enable Option
          4. Table 6-52 Additional SPI0 Master Timings, 4-Pin Chip Select Option
          5. Table 6-53 Additional SPI0 Master Timings, 5-Pin Option
          6. Table 6-54 Additional SPI0 Slave Timings, 4-Pin Enable Option
          7. Table 6-55 Additional SPI0 Slave Timings, 4-Pin Chip Select Option
          8. Table 6-56 Additional SPI0 Slave Timings, 5-Pin Option
    18. 6.18 Enhanced Capture (eCAP) Peripheral
      1. Table 6-58 Enhanced Capture (eCAP) Timing Requirement
      2. Table 6-59 eCAP Switching Characteristics
    19. 6.19 Enhanced Quadrature Encoder (eQEP) Peripheral
      1. Table 6-61 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
      2. Table 6-62 eQEP Switching Characteristics
    20. 6.20 Enhanced Pulse Width Modulator (eHRPWM) Modules
      1. 6.20.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-64 eHRPWM Timing Requirements
        2. Table 6-65 eHRPWM Switching Characteristics
      2. 6.20.2 Trip-Zone Input Timing
    21. 6.21 Timers
      1. 6.21.1 Timer Electrical Data/Timing
        1. Table 6-69 Timing Requirements for Timer Input (see )
        2. Table 6-70 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    22. 6.22 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
      1. 6.22.1 I2C Device-Specific Information
      2. 6.22.2 I2C Peripheral Registers Description(s)
      3. 6.22.3 I2C Electrical Data/Timing
        1. 6.22.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-72 I2C Input Timing Requirements
          2. Table 6-73 I2C Switching Characteristics
    23. 6.23 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.23.1 UART Peripheral Registers Description(s)
      2. 6.23.2 UART Electrical Data/Timing
        1. Table 6-75 Timing Requirements for UARTx Receive (see )
        2. Table 6-76 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    24. 6.24 Power and Sleep Controller (PSC)
      1. 6.24.1 PSC Peripheral Registers Description(s)
      2. 6.24.2 Power Domain and Module Topology
        1. 6.24.2.1 Power Domain States
        2. 6.24.2.2 Module States
    25. 6.25 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.25.1 PRUSS Register Descriptions
    26. 6.26 Emulation Logic
      1. 6.26.1 JTAG Port Description
      2. 6.26.2 Scan Chain Configuration Parameters
      3. 6.26.3 JTAG 1149.1 Boundary Scan Considerations
    27. 6.27 IEEE 1149.1 JTAG
      1. 6.27.1 JTAG Peripheral Register Description(s) – JTAG ID Register
      2. 6.27.2 JTAG Test-Port Electrical Data/Timing
        1. Table 6-91 Timing Requirements for JTAG Test Port (see )
        2. Table 6-92 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZKB
    2. 8.2 Thermal Data for PTP
    3. 8.3 Supplementary Information About the 176-pin PTP PowerPAD™ Package
      1. 8.3.1 Standoff Height
      2. 8.3.2 PowerPAD™ PCB Footprint
    4. 8.4 Mechanical Drawings

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZKB|256
  • PTP|176
サーマルパッド・メカニカル・データ
発注情報

7.2 Documentation Support

The following documents describe the TMS320C6743 Low-power digital signal processor. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.

    DSP Reference Guides
    SPRUG82TMS320C674x DSP Cache User's Guide. Explains the fundamentals of memory caches and describes how the two-level cache-based internal memory architecture in the TMS320C674x digital signal processor (DSP) can be efficiently used in DSP applications. Shows how to maintain coherence with external memory, how to use DMA to reduce memory latencies, and how to optimize your code to improve cache efficiency. The internal memory architecture in the C674x DSP is organized in a two-level hierarchy consisting of a dedicated program cache (L1P) and a dedicated data cache (L1D) on the first level. Accesses by the CPU to the these first level caches can complete without CPU pipeline stalls. If the data requested by the CPU is not contained in cache, it is fetched from the next lower memory level, L2 or external memory.
    SPRUFE8TMS320C674x DSP CPU and Instruction Set Reference Guide. Describes the CPU architecture, pipeline, instruction set, and interrupts for the TMS320C674x digital signal processors (DSPs). The C674x DSP is an enhancement of the C64x+ and C67x+ DSPs with added functionality and an expanded instruction set.
    SPRU186TMS320C6000 Assembly Language Tools User's Guide. Describes the assembly language tools (assembler, linker, and other tools used to develop assembly language code), assembler directives, macros, common object file format, and symbolic debugging directives for the TMS320C6000 platform of devices (including the C64x+, C67x+, and C674x generations).
    SPRU187TMS320C6000 Optimizing Compiler User's Guide. Describes the TMS320C6000 C compiler and the assembly optimizer. This C compiler accepts ANSI standard C source code and produces assembly language source code for the TMS320C6000 platform of devices (including the C64x+, C67x+, and C674x generations). The assembly optimizer helps you optimize your assembly code.
    SPRUH90TMS320C6743 DSP Technical Reference Manual. Describes the System-on-Chip (SoC) and each peripheral in the device.
    SPRUFK5TMS320C674x DSP Megamodule Reference Guide. Describes the TMS320C674x digital signal processor (DSP) megamodule. Included is a discussion on the internal direct memory access (IDMA) controller, the interrupt controller, the power-down controller, memory protection, bandwidth management, and the memory and cache.
    SPRUFK9TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide. Provides an overview and briefly describes the peripherals available on TMS320C6743.