SPNS141G August   2010  – October 2018 TMS570LS10106 , TMS570LS10116 , TMS570LS10206 , TMS570LS20206 , TMS570LS20216

PRODUCTION DATA.  

  1. 1 TMS570LS Series 16/32-BIT RISC Flash Microcontroller
    1. 1.1 Features
    2. 1.2 Description
    3. 1.3 Functional Block Diagram
  2. 2 Device Overview
    1. 2.1 Terms and Acronyms
    2. 2.2 Device Characteristics
    3. 2.3 Memory
      1. 2.3.1 Memory Map
      2. 2.3.2 Flash Memory
      3. 2.3.3 System Modules Assignment
      4. 2.3.4 Peripheral Selects
      5. 2.3.5 Memory Auto-Initialization
      6. 2.3.6 PBIST RAM Self Test
    4. 2.4 Pin Assignments
      1. 2.4.1 PGE QFP Package Pinout (144 pin)
      2. 2.4.2 ZWT BGA Package Pinout (337 ball)
    5. 2.5 Terminal Functions
    6. 2.6 Device Support
      1. 2.6.1 Device and Development-Support Tool Nomenclature
  3. 3 Reset / Abort Sources
    1. 3.1 Reset / Abort Sources
  4. 4 Peripherals
    1. 4.1  Error Signaling Module (ESM)
    2. 4.2  Direct Memory Access (DMA)
    3. 4.3  High End Timer Transfer Unit (HET-TU)
    4. 4.4  Vectored Interrupt Manager (VIM)
    5. 4.5  MIBADC Event Trigger Sources
    6. 4.6  MIBSPI
      1. 4.6.1 MIBSPI Event Trigger Sources
      2. 4.6.2 MIBSPIP5/DMM Pin Multiplexing
    7. 4.7  ETM
    8. 4.8  Debug Scan Chains
      1. 4.8.1 JTAG
    9. 4.9  CCM
      1. 4.9.1 Dual Core Implementation
      2. 4.9.2 CCM-R4
    10. 4.10 LPM
    11. 4.11 Voltage Monitor
    12. 4.12 CRC
    13. 4.13 System Module Access
    14. 4.14 Debug ROM
    15. 4.15 CPU Self Test Controller: STC / LBIST
  5. 5 Device Registers
    1. 5.1 Device Identification Code Register
      1. Table 5-1 Device ID Bit Allocation Register Field Descriptions
    2. 5.2 Die-ID Registers
    3. 5.3 PLL Registers
  6. 6 Device Electrical Specifications
    1. 7 Operating Conditions
      1. 7.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
      2. 7.2 Device Recommended Operating Conditions
      3. 7.3 Electrical Characteristics Over Operating Free-Air Temperature Range
  7. 8 Peripheral and Electrical Specifications
    1. 8.1  Clocks
      1. 8.1.1 PLL And Clock Specifications
      2. 8.1.2 External Reference Resonator/Crystal Oscillator Clock Option
      3. 8.1.3 Validated FMPLL Setting
      4. 8.1.4 LPO And Clock Detection
      5. 8.1.5 Switching Characteristics Over Recommended Operating Conditions For Clocks
        1. 8.1.5.1 Timing - Wait States
    2. 8.2  ECLK Specification
      1. 8.2.1 Switching Characteristics Over Recommended Operating Conditions For External Clocks
    3. 8.3  RST And PORRST Timings
      1. 8.3.1 Timing Requirements For PORRST
      2. 8.3.2 Switching Characteristics Over Recommended Operating Conditions For RST
      3. 8.3.3 IO Status During PORRST
    4. 8.4  TEST Pin Timing
    5. 8.5  DAP - JTAG Scan Interface Timing
      1. 8.5.1 JTAG clock specification 12-MHz and 50-pF load on TDO output
    6. 8.6  Output Timings
      1. 8.6.1 Switching Characteristics For Output Timings Versus Load Capacitance (CL)
    7. 8.7  Input Timings
      1. 8.7.1 Timing Requirements For Input Timings
    8. 8.8  Flash Timings
    9. 8.9  SPI Master Mode Timing Parameters
      1. 8.9.1 SPI Master Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
      2. 8.9.2 SPI Master Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
    10. 8.10 SPI Slave Mode Timing Parameters
      1. 8.10.1 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = input, SPISIMO = input, and SPISOMI = output)
      2. 8.10.2 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = input, SPISIMO = input, and SPISOMI = output)
    11. 8.11 CAN Controller Mode Timings
      1. 8.11.1 Dynamic Characteristics For The CANnTX And CANnRX Pins
    12. 8.12 SCI/LIN Mode Timings
    13. 8.13 FlexRay Controller Mode Timings
      1. 8.13.1 Jitter Timing
    14. 8.14 EMIF Timings
      1. 8.14.1 Read Timing (Asynchronous RAM)
      2. 8.14.2 Write Timing (Asynchronous RAM)
    15. 8.15 ETM Timings
      1. 8.15.1 ETMTRACECLK Timing
      2. 8.15.2 ETMDATA Timing
    16. 8.16 RTP Timings
      1. 8.16.1 RTPCLK Timing
      2. 8.16.2 RTPDATA Timing
      3. 8.16.3 RTPENABLE Timing
    17. 8.17 DMM Timings
      1. 8.17.1 DMMCLK Timing
      2. 8.17.2 DMMDATA Timing
      3. 8.17.3 DMMENA Timing
    18. 8.18 MibADC
      1. 8.18.1 MibADC
      2. 8.18.2 MibADC Recommended Operating Conditions
      3. 8.18.3 Operating Characteristics Over Full Ranges Of Recommended Operating Conditions
      4. 8.18.4 MibADC Input Model
      5. 8.18.5 MibADC Timings
      6. 8.18.6 MibADC Nonlinearity Error
      7. 8.18.7 MibADC Total Error
  8. 9 Revision History
  9. 10Mechanical Packaging and Orderable Information
    1. 10.1 Thermal Data
      1. 10.1.1 PGE (S-PQFP-G144) plastic Quad Flat Pack
      2. 10.1.2 ZWT (S-PBGA-N337) Plastic ball grid array
    2. 10.2 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZWT|337
サーマルパッド・メカニカル・データ
発注情報

4.2 Direct Memory Access (DMA)

The direct-memory access (DMA) controller transfers data to and from any specified location in the device memory map. The DMA supports data transfer for both on-chip memories and peripherals.

The DMA controller on this device supports 16 channels and 32 request lines. Each of the 32 DMA requests are assigned by default to one of the 16 available channels. For DMA requests multiplexed between multiple sources, the DMA controller cannot differentiate between the multiple sources and the user has to ensure that multiple sources are not enabled at the same time. Please refer to the DMA Specification in the TRM for more details.

The DMA request configuration is shown in the following table.

Table 4-3 DMA Request Line Connection

Modules DMA Request Sources DMA Request
MIBSPI1 MIBSPI1[1](1) DMAREQ[0]
MIBSPI1 MIBSPI1[0](2) DMAREQ[1]
Reserved Reserved DMAREQ[2]
Reserved Reserved DMAREQ[3]
MIBSPI1 / MIBSPI3 / DCAN2 MIBSPI1[2] / MIBSPI3[2] / DCAN2 IF3 DMAREQ[4]
MIBSPI1 / MIBSPI3 / DCAN2 MIBSPI1[3] / MIBSPI3[3] / DCAN2 IF2 DMAREQ[5]
MIBSPIP5 / DCAN1 MIBSPIP5[2] / DCAN1 IF2 DMAREQ[6]
MIBADC1 / MIBSPIP5 MIBADC1 event / MIBSPIP5[3] DMAREQ[7]
MIBSPI1 / MIBSPI3 / DCAN1 MIBSPI1[4] / MIBSPI3[4] / DCAN1 IF1 DMAREQ[8]
MIBSPI1 / MIBSPI3 / DCAN2 MIBSPI1[5] / MIBSPI3[5] / DCAN2 IF1 DMAREQ[9]
MIBADC1 / MIBSPIP5 MIBADC1 G1 / MIBSPIP5[4] DMAREQ[10]
MIBADC1 / MIBSPIP5 MIBADC1 G2 / MIBSPIP5[5] DMAREQ[11]
RTI / MIBSPI1 / MIBSPI3 RTI DMAREQ0 / MIBSPI1[6] / MIBSPI3[6] DMAREQ[12]
RTI / MIBSPI1 / MIBSPI3 RTI DMAREQ1 / MIBSPI1[7] / MIBSPI3[7] DMAREQ[13]
MIBADC2 / MIBSPI3 / MIBSPIP5 MIBADC2 event / MIBSPI3[1](1) / MIBSPIP5[6] DMAREQ[14]
MIBSPI3 / MIBSPIP5 MIBSPI3[0]† / MIBSPIP5[7] DMAREQ[15]
MIBADC2 / MIBSPI1 / MIBSPI3 / DCAN1 MIBADC2 G1 / MIBSPI1[8] / MIBSPI3[8] / DCAN1 IF3 DMAREQ[16]
MIBADC2 / MIBSPI1 / MIBSPI3 / DCAN3 MIBADC2 G2 / MIBSPI1[9] / MIBSPI3[9] / DCAN3 IF1 DMAREQ[17]
RTI / MIBSPIP5 RTI DMAREQ2 / MIBSPIP5[8] DMAREQ[18]
RTI / MIBSPIP5 RTI DMAREQ3 / MIBSPIP5[9] DMAREQ[19]
LIN2 / NHET / DCAN3 LIN2 receive / NHET DMAREQ[4] / DCAN3 IF2 DMAREQ[20]
LIN2 / NHET / DCAN3 LIN2 transmit / NHET DMAREQ[5] / DCAN3 IF3 DMAREQ[21]
MIBSPI1 / MIBSPI3 / MIBSPIP5 MIBSPI1[10] / MIBSPI3[10] / MIBSPIP5[10] DMAREQ[22]
MIBSPI1 / MIBSPI3 / MIBSPIP5 MIBSPI1[11] / MIBSPI3[11] / MIBSPIP5[11] DMAREQ[23]
NHET / MIBSPIP5 NHET DMAREQ[6] / MIBSPIP5[12] DMAREQ[24]
NHET / MIBSPIP5 NHET DMAREQ[7] / MIBSPIP5[13] DMAREQ[25]
CRC / MIBSPI1 / MIBSPI3 CRC DMAREQ[0] / MIBSPI1[12] / MIBSPI3[12] DMAREQ[26]
CRC / MIBSPI1 / MIBSPI3 CRC DMAREQ[1] / MIBSPI1[13] / MIBSPI3[13] DMAREQ[27]
LIN1 / MIBSPIP5 LIN1 receive / MIBSPIP5[14] DMAREQ[28]
LIN1 / MIBSPIP5 LIN1 transmit / MIBSPIP5[15] DMAREQ[29]
MIBSPI1 / MIBSPI3 / MIBSPIP5 MIBSPI1[14] / MIBSPI3[14] / MIBSPIP5[1](1) DMAREQ[30]
MIBSPI1 / MIBSPI3 / MIBSPIP5 MIBSPI1[15] / MIBSPI3[15] / MIBSPIP5[0](2) DMAREQ[31]
(1) SPI1, SPI3, SPI5 receive in standard SPI/compatibility mode
(2) SPI1, SPI3, SPI5 transmit in standard SPI/compatibility mode