SLDS182A August   2010  – July 2015 TPIC7218-Q1

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Pin Configuration and Functions
  4. Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Input Port Electrical Characteristics
    6. 4.6  PWM Low-Side Driver Electrical Characteristics
    7. 4.7  Digital Low-Side Driver Electrical Characteristics
    8. 4.8  High-Side Driver Electrical Characteristics
    9. 4.9  K-Line Electrical Characteristics
    10. 4.10 Warning Lamp Electrical Characteristics
    11. 4.11 Power Supply Electrical Characteristics
    12. 4.12 SPI Electrical Characteristics
    13. 4.13 WL_LS Low-Side Switch Output Characteristics
    14. 4.14 Wheel-Speed High-Side Driver Characteristics
    15. 4.15 Wheel-Speed Low-Side Driver Characteristics
    16. 4.16 Wheel-Speed Output Characteristics
    17. 4.17 RST Output Characteristics
    18. 4.18 SPI Timing Electrical Characteristics
    19. 4.19 Power Supply Switching Characteristics
    20. 4.20 Wheel-Speed Counter Switching Characteristics
    21. 4.21 HS Driver Switching Characteristics
    22. 4.22 Digital Low-Side Driver Switching Characteristics
    23. 4.23 PWM Low-Side Driver Switching Characteristics
    24. 4.24 K-Line Switching Characteristics
    25. 4.25 Warning Lamp Switching Characteristics
    26. 4.26 Watchdog Switching Characteristics
    27. 4.27 Wheel Speed Interface Switching Characteristics
    28. 4.28 Wheel-Speed High-Side Driver Switching Characteristics
    29. 4.29 Wheel-Speed Output Switching Characteristics
    30. 4.30 Typical Characteristics
  5. Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1  Ground Connections
      2. 5.3.2  Charge Pump
      3. 5.3.3  Reference Current Generator
      4. 5.3.4  Wheel-Speed Reference, VREF
      5. 5.3.5  Faults Common To Most Functional Blocks
      6. 5.3.6  PWM Low-Side Drivers
      7. 5.3.7  Digital Low-Side Drivers
      8. 5.3.8  High-Side Drivers
        1. 5.3.8.1 High-Side Terminals: GPR, SPR, DPR, and HSPC
        2. 5.3.8.2 High-Side Terminals: GMR, SMR, DMR, and HSMC
      9. 5.3.9  Wheel-Speed Sensing
      10. 5.3.10 K-Line
      11. 5.3.11 Warning Lamp Drivers
      12. 5.3.12 Watchdog Operation
    4. 5.4 Device Functional Modes
      1. 5.4.1 Device Reset
    5. 5.5 Programming
      1. 5.5.1 Serial Peripheral Interface (SPI) Interface To Microcontroller
        1. 5.5.1.1 Summary and Description Of Control and Reporting Registers
    6. 5.6 Register Maps
      1. 5.6.1 SPI Registers
  6. Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 Gatedrive circuit Motor FET
        2. 6.2.2.2 Gatedrive circuit Master Relay FET
      3. 6.2.3 Application Curves
  7. Power Supply Recommendations
  8. Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Local Grounding Configuration
      2. 8.1.2 Board Level Grounding Configuration, TPIC7218-Q1 to System Connector
      3. 8.1.3 VCC3 Bypass Capacitor
      4. 8.1.4 VDD Bypass Capacitor
      5. 8.1.5 VBAT and CHP Capacitors
      6. 8.1.6 Multiple Plane Layer Assignments
      7. 8.1.7 Duplicate Pad Under TPIC7218-Q1 on All Non-Ground Plane Inner Layers
      8. 8.1.8 Flooding
    2. 8.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Community Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

6 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

6.1 Application Information

The TPIC7218-Q1 device, as typically used in anti-lock braking systems, requires very few external components; thus, the design is quite simple.

6.2 Typical Application

A simplified application diagram of the TPIC7218-Q1 device Figure 6-1 shows a simplified application diagram.

TPIC7218-Q1 simplified_app_lds174.gifFigure 6-1 Simplified Application Diagram

6.2.1 Design Requirements

The design of the components needed for the wheel speed sensor interface (VREF voltage and RLOAD) is described in Section 5.3.9. The only other major design requirement is in choice of the resistors connected to pins controlling the pump relay (PR) and main relay (MR) FETs as shown in Figure 6-2. The choice of these resistors is described in Section 6.2.2.

TPIC7218-Q1 des_req_sche_slds182.gifFigure 6-2 xPR and xMR Resistors in Application Diagram

6.2.2 Detailed Design Procedure

The resistor RDMR is to be chosen based on the overcurrent detection value needed for the system relay and pump relay as explained in Section 5.3.8. RSMR resistor value to be chosen to limit the current into the pin in a reverse battery situation - typically in the 1- to 2-kΩ range. See Section 6.2.2.1 for description of the GMR and GPR resistor design procedure.

6.2.2.1 Gatedrive circuit Motor FET

When the pump relay driver at the GPR pin is enabled, it is charged in three different ways. The internal pre-GPR node is shorted to the VBAT supply to give it battery voltage. There are also two current sources that are then enabled at the same time, IDC_GPR and ITRAN_GPR as shown in Figure 6-3. The IDC_GPR current is on any time the pump relay is turned ON. The ITRAN_GPR current source is only enabled for a time tSTGPR after the GPR is turned on. The final voltage will not exceed CHP. The maximum charging time can be obtained from the electrical characteristics table. The turnon time is set by the charging currents with the gate resistor not affecting it significantly. A typical turnon timing characteristic is shown in Figure 6-4, in this case with the IPB 80N06S3L-06 chosen as the pump relay FET.

When the pump relay driver is set to the off state all of the charging paths are disabled and the GPR pin is shorted to GND. The external gate resistance is the primary determinant of the turnoff time. The gate resistor should be sized based on the gate characteristics of the chosen FET and the desired turnoff time. A typical turnoff characteristic with a 10-kΩ resistor is shown in Figure 6-5.

TPIC7218-Q1 pump_motor_FET_gate_lds174.gifFigure 6-3 Pump Relay Gatedriver Circuit

6.2.2.2 Gatedrive circuit Master Relay FET

The circuit used for the gate drive for the master relay FET is similar to the pump motor FET gatedrive with changes in the drive strength as reflected in the turnon times from the electrical characteristics table. The gate resistor for the master relay FET should be chosen using the same procedure as for the pump motor relay driver.

6.2.3 Application Curves

TPIC7218-Q1 app_curve_01_slds182.pngFigure 6-4 Turnon of the FET Gate With a 10-kΩ Gate Resistor.
TPIC7218-Q1 app_curve_02_slds182.pngFigure 6-5 Turnon of the FET Gate With a 10-kΩ Gate Resistor.