JAJSBM7C September   2011  – October 2017 TPS54623

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     効率と負荷電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Adjusting the Output Voltage
      4. 7.3.4  Safe Start-up into Pre-Biased Outputs
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Slow Start (SS/TR)
      9. 7.3.9  Power Good (PWRGD)
      10. 7.3.10 Bootstrap Voltage (BOOT) and Low Dropout Operation
      11. 7.3.11 Sequencing (SS/TR)
      12. 7.3.12 Output Overvoltage Protection (OVP)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 High-side MOSFET Overcurrent Protection
        2. 7.3.13.2 Low-side MOSFET Overcurrent Protection
      14. 7.3.14 Thermal Shutdown
      15. 7.3.15 Small Signal Model for Loop Response
      16. 7.3.16 Simple Small Signal Model for Peak Current Mode Control
      17. 7.3.17 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed Frequency PWM Control
      2. 7.4.2 Continuous Current Mode Operation (CCM)
      3. 7.4.3 Light Load Efficiency Operation
      4. 7.4.4 Adjustable Switching Frequency and Synchronization (RT/CLK)
        1. 7.4.4.1 Adjustable Switching Frequency (RT Mode)
        2. 7.4.4.2 Synchronization (CLK mode)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Fast Transient Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Operating Frequency
        3. 8.2.2.3  Output Inductor Selection
        4. 8.2.2.4  Output Capacitor Selection
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  Slow Start Capacitor Selection
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  Under Voltage Lockout Set Point
        9. 8.2.2.9  Output Voltage Feedback Resistor Selection
          1. 8.2.2.9.1 Minimum Output Voltage
        10. 8.2.2.10 Compensation Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Estimated Circuit Area
    2. 10.2 Layout Examples
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 開発サポート
      3. 11.1.3 WEBENCH®ツールによるカスタム設計
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)(2) TPS54623 UNIT
RHL (VQFN)
14 PINS
RθJA Junction-to-ambient Thermal resistance 40.1 °C/W
Test board(3) 32
RθJC(top) Junction-to-case (top) thermal resistance 34.4 °C/W
RθJB Junction-to-board thermal resistance 11.4 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 11.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below 150°C for best performance and long-term reliability. See power dissipation estimate in application section of this data sheet for more information.
(3) Test board conditions:
  1. 2.5 inches × 2.5 inches, 4 layers, thickness: 0.062 inch
  2. 2 oz. copper traces located on the top of the PCB
  3. 2 oz. copper ground planes on the 2 internal layers and bottom layer
  4. 4 0.010 inch thermal vias located under the device package