SNVSA76B March   2015  – March 2017 TPS61177A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Supply Voltage
      2. 7.3.2  Boost Regulator
      3. 7.3.3  Programmable Switch Frequency and Slew Rate
      4. 7.3.4  LED Current Sinks
      5. 7.3.5  Enable and Start-Up Timing
      6. 7.3.6  Input Undervoltage Protection (UVLO)
      7. 7.3.7  Overvoltage Protection (OVP)
      8. 7.3.8  Current-Sink Open Protection
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Selection
      2. 7.4.2 Analog and PWM Mixed Dimming Mode
      3. 7.4.3 Analog Dimming Mode
      4. 7.4.4 Direct PWM Dimming
    5. 7.5 Programming
      1. 7.5.1 Configuration Parameters
    6. 7.6 Register Maps
      1. 7.6.1  MODE (A0h)
      2. 7.6.2  CS (A1h)
      3. 7.6.3  UVLO (A2h)
      4. 7.6.4  FREQ (A3h)
      5. 7.6.5  SR (A4h)
      6. 7.6.6  ILIM (A5h)
      7. 7.6.7  Control (FFh)
      8. 7.6.8  Example - Writing to a Single RAM Register
      9. 7.6.9  Example - Writing to Multiple RAM Registers
      10. 7.6.10 Example - Saving Contents of all RAM Registers to E2PROM
      11. 7.6.11 Example - Reading from a Single RAM Register
      12. 7.6.12 Example - Reading from a Single E2PROM Register
      13. 7.6.13 Example - Reading from Multiple RAM Registers
      14. 7.6.14 Example - Reading from Multiple E2PROM Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 CS Pin Unused
      2. 8.1.2 Brightness Dimming Control
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.