JAJSPL9 july   2023 TPS631012 , TPS631013

PRODMIX  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Rating
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics 
    6. 7.6 Timing Requirements
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Enable and Soft Start
      3. 8.3.3 Device Enable (EN)
      4. 8.3.4 Output Voltage Control
      5. 8.3.5 Mode Selection (PFM/FPWM)
      6. 8.3.6 Output Discharge
      7. 8.3.7 Reverse Current Operation
      8. 8.3.8 Protection Features
        1. 8.3.8.1 Input Overvoltage Protection
        2. 8.3.8.2 Output Overvoltage Protection
        3. 8.3.8.3 Short Circuit Protection/Hiccup
        4. 8.3.8.4 Thermal Shutdown
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 8.5.3 I2C Update Sequence
    6. 8.6 Register Map
      1. 8.6.1 Register Description
        1. 8.6.1.1 Register Map
        2. 8.6.1.2 Register CONTROL1 (Register address: 0x02; Default: 0x08)
        3. 8.6.1.3 Register VOUT (Register address: 0x03; Default: 0x5C)
        4. 8.6.1.4 Register CONTROL2 (Register address: 0x05; Default: 0x45)
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Setting the Output Voltage
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 サード・パーティ製品に関する免責事項
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.