JAJSQ10E march   2012  – may 2023 TPS7A16-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 説明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 PG Delay Timer (DELAY)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Good
      2. 7.4.2 Power-Good Delay and Delay Capacitor
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS7A1601-Q1 Circuit as an Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Adjustable Voltage Operation
          2. 8.2.1.2.2 Resistor Selection
          3. 8.2.1.2.3 Capacitor Recommendations
          4. 8.2.1.2.4 Input and Output Capacitor Requirements
          5. 8.2.1.2.5 Feed-Forward Capacitor (Only for Adjustable Version)
          6. 8.2.1.2.6 Transient Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Automotive Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Device Recommendations
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Multicell Battery Packs
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 Battery-Operated Power Tools
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Additional Layout Considerations
        2. 8.4.1.2 Power Dissipation
        3. 8.4.1.3 Thermal Considerations
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

GUID-20230307-SS0I-JTCT-PGGX-77MFM4MWXK2T-low.svg
NC – No internal connection
Figure 5-1 DGN Package,8-Pin HVSSOP With Exposed Thermal Pad(Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
DELAY 7 O Delay pin. Connect a capacitor to GND to adjust the PG delay time; leave open if the reset function is not needed.
EN 5 I Enable pin. This pin turns the regulator on or off.
If VEN ≥ VEN_HI, the regulator is enabled.
If VEN ≤ VEN_LO, the regulator is disabled.
If not used, the EN pin can be connected to IN. Make sure that VEN ≤ VIN at all times.
FB/NC 2 I This pin is a feedback pin when using an external resistor divider or an NC pin when using the device with a fixed output voltage. When using the adjustable device, this pin must be connected through a resistor divider to the output for the device to function. If using a fixed output this pin can either be left floating or connected to GND.
GND 4 — Ground pin
IN 8 I Regulator input supply pin. A capacitor > 0.1 µF must be tied from this pin to ground to assure stability. Connect a 10-µF ceramic capacitor from IN to GND (as close to the device as possible) to reduce circuit sensitivity to printed-circuit-board (PCB) layout, especially when long input tracer or high source impedances are encountered.
NC 6 — This pin can be left open or tied to any voltage between GND and IN.
OUT 1 O Regulator output pin. A capacitor > 2.2 µF must be tied from this pin to ground to assure stability. Connect a 10-µF ceramic capacitor from OUT to GND (as close to the device as possible) to maximize ac performance.
PG 3 O Power-good pin. Open-collector output; leave open or connect to GND if the power-good function is not needed.
Thermal pad — Solder to printed circuit board (PCB) to enhance thermal performance. Although the thermal pad can be left floating, connecting the thermal pad to the GND plane is highly recommended.