JAJSQH1A june 2023 – july 2023 TSD05C
PRODUCTION DATA
THERMAL METRIC (1) | TSD05C | UNIT | |
---|---|---|---|
DYF (SOD-323) | |||
2 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 682.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 264.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 558.0 | °C/W |
ΨJT | Junction-to-top characterization parameter | 89.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 544.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | NA | °C/W |