JAJSCW4C december   2016  – september 2020 CC2640R2F

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
    5. 7.5 Pin Diagram – YFV (Chip Scale, DSBGA) Package
    6. 7.6 Signal Descriptions – YFV (Chip Scale, DSBGA) Package
    7. 7.7 Pin Diagram – RSM Package
    8. 7.8 Signal Descriptions – RSM Package
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Continuous Time Comparator
    22. 8.22 Low-Power Clocked Comparator
    23. 8.23 Programmable Current Source
    24. 8.24 Synchronous Serial Interface (SSI)
    25. 8.25 DC Characteristics
    26. 8.26 Thermal Resistance Characteristics
    27. 8.27 Timing Requirements
    28. 8.28 Switching Characteristics
    29. 8.29 Typical Characteristics
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Sensor Controller
    6. 9.6  Memory
    7. 9.7  Debug
    8. 9.8  Power Management
    9. 9.9  Clock Systems
    10. 9.10 General Peripherals and Modules
    11. 9.11 Voltage Supply Domains
    12. 9.12 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
    3. 10.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 10.3.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  Texas Instruments Low-Power RF Website
    5. 11.5  Low-Power RF eNewsletter
    6. 11.6  サポート・リソース
    7. 11.7  Trademarks
    8. 11.8  静電気放電に関する注意事項
    9. 11.9  Export Control Notice
    10. 11.10 用語集
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

1-Mbps GFSK (Bluetooth low energy) – RX

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Receiver sensitivity Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10–3 –97 dBm
Receiver sensitivity Single-ended mode. Measured on CC2650EM-4XS, at the SMA connector, BER = 10–3 –96 dBm
Receiver saturation Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10–3 4 dBm
Receiver saturation Single-ended mode. Measured on CC2650EM-4XS, at the SMA connector, BER = 10–3 0 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency –350 350 kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate –750 750 ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 –6 dB
Selectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 3(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10–3 34 / 25(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 38 / 26(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 42 / 29(2) dB
Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at
≥ ±5 MHz, BER = 10–3
32 dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 25 dB
Selectivity, image frequency
±1 MHz(1)
Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 3 / 26(2) dB
Out-of-band blocking (3) 30 MHz to 2000 MHz –20 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –10 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level –34 dBm
Spurious emissions,
30 to 1000 MHz
Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –71 dBm
Spurious emissions,
1 to 12.75 GHz
Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –62 dBm
RSSI dynamic range 70 dB
RSSI accuracy ±4 dB
Numbers given as I/C dB.
X / Y, where X is +N MHz and Y is –N MHz.
Excluding one exception at Fwanted / 2, per Bluetooth Specification.