JAJSCW4C december   2016  – september 2020 CC2640R2F

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
    5. 7.5 Pin Diagram – YFV (Chip Scale, DSBGA) Package
    6. 7.6 Signal Descriptions – YFV (Chip Scale, DSBGA) Package
    7. 7.7 Pin Diagram – RSM Package
    8. 7.8 Signal Descriptions – RSM Package
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Continuous Time Comparator
    22. 8.22 Low-Power Clocked Comparator
    23. 8.23 Programmable Current Source
    24. 8.24 Synchronous Serial Interface (SSI)
    25. 8.25 DC Characteristics
    26. 8.26 Thermal Resistance Characteristics
    27. 8.27 Timing Requirements
    28. 8.28 Switching Characteristics
    29. 8.29 Typical Characteristics
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Sensor Controller
    6. 9.6  Memory
    7. 9.7  Debug
    8. 9.8  Power Management
    9. 9.9  Clock Systems
    10. 9.10 General Peripherals and Modules
    11. 9.11 Voltage Supply Domains
    12. 9.12 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
    3. 10.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 10.3.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  Texas Instruments Low-Power RF Website
    5. 11.5  Low-Power RF eNewsletter
    6. 11.6  サポート・リソース
    7. 11.7  Trademarks
    8. 11.8  静電気放電に関する注意事項
    9. 11.9  Export Control Notice
    10. 11.10 用語集
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

500-kbps Coded (Bluetooth 5) – RX

Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Receiver sensitivityDifferential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10–3–101dBm
Receiver saturationDifferential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10–3>5dBm
Frequency error toleranceDifference between the incoming carrier frequency and the internally generated carrier frequency–240240kHz
Data rate error toleranceDifference between incoming data rate and the internally generated data rate (37-byte packets)–500500ppm
Data rate error toleranceDifference between incoming data rate and the internally generated data rate (255-byte packets)–310330ppm
Co-channel rejection (1)Wanted signal at –72 dBm, modulated interferer in channel, BER = 10–3–5dB
Selectivity, ±1 MHz (1)Wanted signal at –72 dBm, modulated interferer at ±1 MHz, BER = 10–39 / 5(2)dB
Selectivity, ±2 MHz (1)Wanted signal at –72 dBm, modulated interferer at ±2 MHz, Image frequency is at –2 MHz, BER = 10–341 / 31(2)dB
Selectivity, ±3 MHz (1)Wanted signal at –72 dBm, modulated interferer at ±3 MHz, BER = 10–344 / 41(2)dB
Selectivity, ±4 MHz (1)Wanted signal at –72 dBm, modulated interferer at ±4 MHz, BER = 10–344 / 44(2)dB
Selectivity, ±6 MHz (1)Wanted signal at –72 dBm, modulated interferer at ±6 MHz, BER = 10–344 / 44(2)dB
Alternate channel rejection,
±7 MHz(1)
Wanted signal at –72 dBm, modulated interferer at
≥ ±7 MHz, BER = 10–3
44 / 44(2)dB
Selectivity, image frequency(1)Wanted signal at –72 dBm, modulated interferer at image frequency, BER = 10–331dB
Selectivity, image frequency
±1 MHz(1)
Note that Image frequency + 1 MHz is the Co-channel –1 MHz. Wanted signal at –72 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–35 / 41(2)dB
Blocker rejection, ±8 MHz and above(1)Wanted signal at –72 dBm, modulated interferer at ±8 MHz and above, BER = 10–344dB
Out-of-band blocking (3)30 MHz to 2000 MHz–35dBm
Out-of-band blocking2003 MHz to 2399 MHz–19dBm
Out-of-band blocking2484 MHz to 2997 MHz–19dBm
IntermodulationWanted signal at 2402 MHz, –69 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level–37dBm
Numbers given as I/C dB.
X / Y, where X is +N MHz and Y is –N MHz.
Excluding one exception at Fwanted / 2, per Bluetooth Specification.