JAJSEJ0E January   2018  – April 2019 TS5MP646

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      D-PHYの概略回路図
      2.      C-PHYの概略回路図
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Powered-Off Protection
      2. 8.3.2 1.8-V Logic Compatible Inputs
      3. 8.3.3 Low Power Disable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Functions
      2. 8.4.2 Low Power Disable Mode
      3. 8.4.3 Switch Enabled Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 MIPI D-PHY Application
        2. 9.2.3.2 MIPI C-PHY Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

Thermal Information

THERMAL METRIC(1) TS5MP646 UNIT
YFP
36
RθJA Junction-to-ambient thermal resistance 57.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.3 °C/W
RθJB Junction-to-board thermal resistance 12.6 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 12.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.