SLLSEY6G October   2017  – February 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC
    4. 5.4 Thermal Information
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Requirements
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  LIN (Local Interconnect Network) Bus
        1. 7.3.1.1 LIN Transmitter Characteristics
        2. 7.3.1.2 LIN Receiver Characteristics
          1. 7.3.1.2.1 Termination
      2. 7.3.2  TXD (Transmit Input and Output)
      3. 7.3.3  RXD (Receive Output)
      4. 7.3.4  VSUP (Supply Voltage)
      5. 7.3.5  GND (Ground)
      6. 7.3.6  EN (Enable Input)
      7. 7.3.7  Protection Features
      8. 7.3.8  TXD Dominant Time Out (DTO)
      9. 7.3.9  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Under Voltage on VSUP
      12. 7.3.12 Unpowered Device and LIN Bus
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Wake-Up Events
        1. 7.4.4.1 Wake-Up Request (RXD)
        2. 7.4.4.2 Mode Transitions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Normal Mode Application Note
        2. 8.2.2.2 Standby Mode Application Note
          1. 8.2.2.2.1 TXD Dominant State Timeout Application Note
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TLIN2029D
TLIN2029DRB
UNIT
D (SOIC) DRB (VSON)
8-PINS 8-PINS
RΘJA Junction-to-ambient thermal resistance 115.5 48.5 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 58.7 55.5 °C/W
RΘJB Junction-to-board thermal resistance 58.9 22.2 °C/W
ΨJT Junction-to-top characterization parameter 14.1 1.2 °C/W
ΨJB Junction-to-board characterization parameter 58.2 22.2 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance - 4.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.