SLUUCF7 April   2021 BQ25960

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 EVM Features
    2. 1.2 I/O Descriptions
  3. 2Test Summary
    1. 2.1 Equipment
    2. 2.2 Equipment Setup
    3. 2.3 Software Setup
    4. 2.4 Test Procedure
      1. 2.4.1 Initial Settings
      2. 2.4.2 Communication Verification
      3. 2.4.3 Switched Cap Mode Charge Verification
      4. 2.4.4 Bypass Mode Charge Verification
      5. 2.4.5 Dual BQ25960 Operation
      6. 2.4.6 BQ25611D Charge Verification
  4. 3PCB Layout Guidelines
  5. 4Board Layout, Schematic, and Bill of Materials
    1. 4.1 Board Layout
    2. 4.2 Schematic
    3. 4.3 Bill of Materials

4.1 Board Layout

Figure 4-1 through Figure 4-8 illustrate the PCB layout.


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Figure 4-1 BMS041 Top Overlay

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Figure 4-2 BMS041 Bottom Overlay

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Figure 4-3 BMS041 Top Layer

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Figure 4-4 BMS041 Signal Layer 1

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Figure 4-5 BMS041 Signal Layer 2

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Figure 4-6 BMS041 Signal Layer 3

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Figure 4-7 BMS041 Signal Layer 4

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Figure 4-8 BMS041 Bottom Layer