1 Introduction

Designing systems around integrated circuits requires careful consideration of their physical formats and dimensions. Devices often come in standardized package sizes, but their pin layouts and footprints often vary between models and manufacturers. Land patterns, which are the dimensions of the metal pads that component leads are soldered to, are subject to even more variation. A given land pattern is not always compatible with other products of the same package size and pin functionality. This makes it more difficult to adapt the system for alternative parts when conducting tests or adapting to supply shortages. TI designed universal land patterns for oscillators with 6-pin, 3.2-mm × 2.5-mm and 2.5-mm × 2.0-mm packages that can fit all such devices on the market and are readily compatible with the new LMK6H, LMK6P, and LMK6D (hereafter, LMK6D/P/H) bulk acoustic wave (BAW) oscillators. PCB designers are strongly recommended to use the universal land patterns to increase the flexibility of their systems at no additional cost.