SLUUCU7 November   2023 BQ25960H

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Equipment
    2. 2.2 Equipment Setup
    3. 2.3 I/O Descriptions
  9. 3Software
    1. 3.1 Software Setup
  10. 4Implementation Results
    1. 4.1 Test Procedure
      1. 4.1.1 Initial Settings
      2. 4.1.2 Communication Verification
      3. 4.1.3 Switched Cap Mode Charge Verification
      4. 4.1.4 Bypass Mode Charge Verification
      5. 4.1.5 Dual BQ25960H Operation
      6. 4.1.6 BQ25611D Charge Verification
  11. 5Hardware Design Files
    1. 5.1 Schematic
    2. 5.2 PCB Layout Guidelines
      1. 5.2.1 Board Layout
    3. 5.3 Bill of Materials
  12. 6Additional Information
    1.     Trademarks

5.2 PCB Layout Guidelines

The PCB layout is very important to maximize the electrical and thermal performance of the total system. General guidelines are provided, but the form factor, board stack-up, and proximity of other components also need to be considered to maximize the performance.

  1. VBUS and VOUT copper pours needs to be as short and wide as possible to accommodate high current.
  2. VBUS and VOUT copper pours runs at least 150 mil (3.81 mm) straight (perpendicular to the WCSP ball array) before making turns.
  3. CFLY caps needs to be placed as close as possible to the device, and the CFLY copper pours needs to be as wide as possible until close to the IC.
  4. CFLY pours needs to be as symmetrical as possible between CFH pads and CFL pads.
  5. Place low ESR bypass capacitors to ground for VBUS, PMID, and VOUT. These capacitors needs to be placed as close to the device pins as possible.
  6. The CFLY pads needs to be as small as possible, and the CFLY caps placed as close as possible to the device, as these are switching pins and this helps reduce EMI.
  7. Do not route so the power planes are interrupted by signal traces.