SLUUCY8 December   2023 BQ77307

 

  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Battery Notational Conventions
    3.     Trademarks
    4.     Glossary
  3. 1 Introduction
  4. 2 Device Description
    1. 2.1 Overview
    2. 2.2 Functional Block Diagram
  5. 3 Device Configuration
    1. 3.1 Direct Commands and Subcommands
    2. 3.2 Configuration Using OTP or Registers
    3. 3.3 Data Formats
      1. 3.3.1 Unsigned Integer
      2. 3.3.2 Integer
      3. 3.3.3 Hex
  6. 4 Device Security
  7. 5 Protection Subsystem
    1. 5.1  Protections Overview
    2. 5.2  Protection Evaluation and Detection
    3. 5.3  Protection FET Drivers
    4. 5.4  Cell Overvoltage Protection
    5. 5.5  Cell Undervoltage Protection
    6. 5.6  Short Circuit in Discharge Protection
    7. 5.7  Overcurrent in Charge Protection
    8. 5.8  Overcurrent in Discharge 1 and 2 Protections
    9. 5.9  Current Protection Latch
    10. 5.10 CHG Detector
    11. 5.11 Overtemperature in Charge Protection
    12. 5.12 Overtemperature in Discharge Protection
    13. 5.13 Internal Overtemperature Protection
    14. 5.14 Undertemperature in Charge Protection
    15. 5.15 Undertemperature in Discharge Protection
    16. 5.16 Cell Open Wire Detection
    17. 5.17 Voltage Reference Diagnostic Protection
    18. 5.18 VSS Diagnostic Protection
    19. 5.19 REGOUT Diagnostic Protection
    20. 5.20 LFO Oscillator Integrity Diagnostic Protection
    21. 5.21 Internal Factory Trim Diagnostic Protection
  8. 6 Device Status and Controls
    1. 6.1 0x00 Control Status() and 0x12 Battery Status() Commands
    2. 6.2 Unused VC Cell Input Pins
    3. 6.3 LDOs
    4. 6.4 ALERT Pin Operation
    5. 6.5 TS Pin Operation
    6. 6.6 Device Event Timing
  9. 7 Operational Modes
    1. 7.1 Overview of Operational Modes
    2. 7.2 NORMAL Mode
    3. 7.3 SHUTDOWN Mode
    4. 7.4 CONFIG_UPDATE Mode
  10. 8 I2C Serial Communications
    1. 8.1 I2C Serial Communications Interface
  11. 9 Commands and Subcommands
    1. 9.1 Direct Commands
    2. 9.2 Bit Field Definitions for Direct Commands
      1. 9.2.1  Safety Alert A Register
      2. 9.2.2  Safety Status A Register
      3. 9.2.3  Safety Alert B Register
      4. 9.2.4  Safety Status B Register
      5. 9.2.5  Battery Status Register
      6. 9.2.6  Alarm Status Register
      7. 9.2.7  Alarm Raw Status Register
      8. 9.2.8  Alarm Enable Register
      9. 9.2.9  FET CONTROL Register
      10. 9.2.10 REGOUT CONTROL Register
    3. 9.3 Command-only Subcommands
    4. 9.4 Subcommands with Data
    5. 9.5 Bitfield Definitions for Subcommands
      1. 9.5.1 DEVICE NUMBER Register
      2. 9.5.2 FW VERSION Register
      3. 9.5.3 HW VERSION Register
      4. 9.5.4 SECURITY KEYS Register
      5. 9.5.5 PROT RECOVERY Register
  12. 10Data Memory
    1. 10.1 Settings
      1. 10.1.1 Settings:Configuration
        1. 10.1.1.1  Settings:Configuration:Reserved
        2. 10.1.1.2  Settings:Configuration:Power Config
        3. 10.1.1.3  Settings:Configuration:REGOUT Config
        4. 10.1.1.4  Settings:Configuration:I2C Address
        5. 10.1.1.5  Settings:Configuration:I2C Config
        6. 10.1.1.6  Settings:Configuration:TS Mode
        7. 10.1.1.7  Settings:Configuration:Vcell Mode
        8. 10.1.1.8  Settings:Configuration:Default Alarm Mask
        9. 10.1.1.9  Settings:Configuration:FET Options
        10. 10.1.1.10 Settings:Configuration:Charge Detector Time
      2. 10.1.2 Settings:Protection
        1. 10.1.2.1 Settings:Protection:Enabled Protections A
        2. 10.1.2.2 Settings:Protection:Enabled Protections B
        3. 10.1.2.3 Settings:Protection:DSG FET Protections A
        4. 10.1.2.4 Settings:Protection:CHG FET Protections A
        5. 10.1.2.5 Settings:Protection:Both FET Protections B
        6. 10.1.2.6 Settings:Protection:Cell Open Wire Check Time
    2. 10.2 Protections
      1. 10.2.1 Protections:Cell Voltage
        1. 10.2.1.1 Protections:Cell Voltage:Cell Undervoltage Protection Threshold
        2. 10.2.1.2 Protections:Cell Voltage:Cell Undervoltage Protection Delay
        3. 10.2.1.3 Protections:Cell Voltage:Cell Undervoltage Protection Recovery Hysteresis
        4. 10.2.1.4 Protections:Cell Voltage:Cell Overvoltage Protection Threshold
        5. 10.2.1.5 Protections:Cell Voltage:Cell Overvoltage Protection Delay
        6. 10.2.1.6 Protections:Cell Voltage:Cell Overvoltage Protection Recovery Hysteresis
      2. 10.2.2 Protections:Current
        1. 10.2.2.1  Protections:Current:Overcurrent in Charge Protection Threshold
        2. 10.2.2.2  Protections:Current:Overcurrent in Charge Protection Delay
        3. 10.2.2.3  Protections:Current:Overcurrent in Discharge 1 Protection Threshold
        4. 10.2.2.4  Protections:Current:Overcurrent in Discharge 1 Protection Delay
        5. 10.2.2.5  Protections:Current:Overcurrent in Discharge 2 Protection Threshold
        6. 10.2.2.6  Protections:Current:Overcurrent in Discharge 2 Protection Delay
        7. 10.2.2.7  Protections:Current:Short Circuit in Discharge Protection Threshold
        8. 10.2.2.8  Protections:Current:Short Circuit in Discharge Protection Delay
        9. 10.2.2.9  Protections:Current:Latch Limit
        10. 10.2.2.10 Protections:Current:Recovery Time
      3. 10.2.3 Protections:Temperature
        1. 10.2.3.1  Protections:Temperature:Overtemperature in Charge Protection Threshold
        2. 10.2.3.2  Protections:Temperature:Overtemperature in Charge Protection Delay
        3. 10.2.3.3  Protections:Temperature:Overtemperature in Charge Protection Recovery
        4. 10.2.3.4  Protections:Temperature:Undertemperature in Charge Protection Threshold
        5. 10.2.3.5  Protections:Temperature:Undertemperature in Charge Protection Delay
        6. 10.2.3.6  Protections:Temperature:Undertemperature in Charge Protection Recovery
        7. 10.2.3.7  Protections:Temperature:Overtemperature in Discharge Protection Threshold
        8. 10.2.3.8  Protections:Temperature:Overtemperature in Discharge Protection Delay
        9. 10.2.3.9  Protections:Temperature:Overtemperature in Discharge Protection Recovery
        10. 10.2.3.10 Protections:Temperature:Undertemperature in Discharge Protection Threshold
        11. 10.2.3.11 Protections:Temperature:Undertemperature in Discharge Protection Delay
        12. 10.2.3.12 Protections:Temperature:Undertemperature in Discharge Protection Recovery
        13. 10.2.3.13 Protections:Temperature:Internal Overtemperature Protection Threshold
        14. 10.2.3.14 Protections:Temperature:Internal Overtemperature Protection Delay
        15. 10.2.3.15 Protections:Temperature:Internal Overtemperature Protection Recovery
    3. 10.3 Power
      1. 10.3.1 Power:Configuration
        1. 10.3.1.1 Power:Configuration:Voltage CHECK Time
        2. 10.3.1.2 Power:Configuration:Body Diode Threshold
      2. 10.3.2 Power:Shutdown
        1. 10.3.2.1 Power:Shutdown:Shutdown Cell Voltage
        2. 10.3.2.2 Power:Shutdown:Shutdown Stack Voltage
        3. 10.3.2.3 Power:Shutdown:Shutdown Temperature
    4. 10.4 Security
      1. 10.4.1 Security:Settings
        1. 10.4.1.1 Security:Settings:Security Settings
        2. 10.4.1.2 Security:Settings:Full Access Key Step 1
        3. 10.4.1.3 Security:Settings:Full Access Key Step 2
      2. 10.4.2 Data Memory Summary
  13. 11Revision History

7.3 SHUTDOWN Mode

SHUTDOWN mode is the lowest power mode of the BQ77307, which can be used for shipping or long term storage. In this mode, the device loses all register state information (except for what has been programmed into OTP by TI), the internal logic is powered down, the protection FETs are all disabled, so no voltage is provided at the battery pack terminals. All protections are disabled, all voltage, current, and temperature measurements are disabled, and no communications are supported. When the device exits SHUTDOWN mode, it reads any parameters stored in OTP. If the OTP has not been programmed (this is only supported by TI), the device powers up with default settings, and then settings can be changed by the host writing device registers.

The device can be configured to enter SHUTDOWN mode automatically based on the minimum top of stack voltage, the minimum cell voltage, or an excessive die temperature. If the top-of-stack voltage falls below Power:Shutdown:Shutdown Stack Voltage or if the minimum cell voltage falls below Power:Shutdown:Shutdown Cell Voltage, or if the internal die temperature exceeds Power:Shutdown:Shutdown Temperature, the SHUTDOWN mode sequence is automatically initiated. The shutdown based on cell voltage only applies to cell input pins being used for actual cells, based on settings in Settings:Configuration:Vcell Mode.

The BQ77307 integrates a hardware overtemperature detection circuit, which determines when the die temperature passes an excessive temperature of approximately 120°C. If this detector triggers, the device automatically begins the sequence to enter SHUTDOWN, based on the configuration setting.

When the device is wakened from SHUTDOWN, it requires approximately 10 ms for the internal circuitry to power up, load settings from OTP memory, perform initial evaluation of conditions relative to enabled protections, then to enable FETs if conditions and settings allow.

The BQ77307 wakes from SHUTDOWN if a voltage is applied at the TS or VC0 pins above a level of approximately 1.2 V. If the shutdown sequence has been initiated, but the device detects the wakeup criteria (either the TS or VCO pin voltage detected high) is present, then the device stays in a "soft shutdown" state until the wakeup criteria has been removed (meaning both the TS and VCO pin voltages must be detected low). While in "soft shutdown", FETs and protections are disabled. The device exits "soft shutdown" when conditions allow the device to continue into SHUTDOWN mode. If the host wants to abort the entry into SHUTDOWN mode, the 0x0012 RESET()command can be written, and the device restarts operation as if returning from a POR.

When the SHUTDOWN mode sequence has been initiated by the stack voltage detected below Power:Shutdown:Shutdown Stack Voltage or a cell voltage detected below Power:Shutdown:Shutdown Cell Voltage, the device asserts the Alarm Raw Status()[SHUTV] bit and wait for 10 seconds to disable the protection FETs, then proceed toward SHUTDOWN mode. During this 10 second shutdown delay, the device does not abort entering SHUTDOWN if the voltages rise back above the shutdown thresholds. If the host prefers to abort the SHUTDOWN entry, it can send the 0x0012 RESET() command, and the device restarts with settings loaded from OTP.

When the device is wakened from SHUTDOWN, it requires < 10 ms for the internal circuitry to power up, load settings from OTP memory, evaluate conditions relative to enabled protections, then enable FETs if conditions allow.