SLVAEM2A January   2020  – March 2021 TPS3700-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DDC Package
    2. 2.2 DSE Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DDC Package
    2. 4.2 DSE Package

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TPS3700-Q1 (DDC and DSE package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Unless otherwise specified, it is assumed that the voltages applied to all the pins are within the Recommended Operating Range specified in the TPS3700-Q1 data sheet.
  • VDD = 5 V
  • OUTA and OUTB pulled-up to VDD unless stated otherwise.