3 BAW Oscillator Integration

The LMK6C/D/P/H contains a BAW resonator, Fractional Output Divider (FOD), and output driver, which together generate a pre-programmed output frequency. Temperature variations of oscillation frequency are continuously monitored by an internal precision temperature sensor and is provided as an input to the Frequency Control Logic block. Using this Frequency Control Logic block, frequency corrections are performed internally for maintaining the output frequency within ±25 ppm across temperature range and aging. The output driver is capable of providing both single-ended LVCMOS and differential LVPECL, LVDS, and HCSL output formats. The device also contains an internal LDO which reduces the power supply noise, resulting in low noise clock output.

Figure 3-1 shows the pre-mold integration of the BAW oscillator. The BAW oscillator contains a base die which includes the additional IC circuitry such as the FOD, LDO, and temperature sensor and the BAW resonator die. The WLP (wafer-level package) is utilized to increase device reliability in terms of vibration and shock immunity as well as further stress isolation.

Figure 3-1 BAW and Base Die Integration

The results are a simple 4 pin (single ended LVCMOS) or 6 pin (differential, LVPECL, LVDS, HCSL) industry standard 3.2 mm × 2.5 mm or 2.5 mm × 2.0 mm packages that are pin to pin compatible to the alternatives allowing for drop in replacement.