SPRAD67A december 2022 – july 2023 AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442
The High-Speed Interface Layout Guidelines application note provides guidance for successful routing of the high-speed differential signals. This includes PCB stack-up and materials guidance as well as routing skew, length, and spacing limits. TI supports only designs that follow the board design guidelines contained in the application report.
Consider using the SK-AM64B (AM64B starter kit for AM64x Sitara processors), TMDS64EVM (AM64x evaluation module for Sitara processors) and TMDS243EVM (AM243x evaluation module for Arm Cortex-R5F-based MCUs) layouts as reference.