SWRA801 January   2024 AWR2544

 

  1.   1
  2.   Abstract
  3. 1Importance of mmWave and LoP in Automotive Radars
  4. 2Evolution From Non-LoP With Microstrip Patch Antenna to LoP With 3D Antennas
  5. 3Introduction to TI Launch on Package (LOP)
  6. 4LOP Design and Operation at 77GHz
  7. 5Advantages of LoP for mmWave Radar Chips
  8. 6Applications in Front and Corner Radars
  9. 7Challenges and Future Developments
  10. 8Conclusion

Abstract

The landscape of automotive radar technology has undergone significant transformation, particularly in the realm of millimeter-wave (mmWave) semiconductor package technology and 3D waveguide antenna. From the initial use of microstrip patch antennas to the evolution towards 3D antennas, the quest for improved performance and efficiency has been relentless. TI’s Launch on Package (LoP) technology enables direct signal transmission from the package radiating element to the 3D antenna through the waveguide within the PCB, thereby enabling efficient electromagnetic signal transfer. In the current era, the spotlight is on LoP technologies, accompanied by sophisticated 3D waveguide antennas for providing better range and object detection.