3 Introduction to TI Launch on Package (LOP)

mmWave LoP is the latest innovation in radar package technology. These advancements focus on the seamless integration of mmWave radar integrated chips with 3D antennas, presenting a paradigm shift in design and functionality. TI LoP technology is a promising avenue for optimizing performance, reducing emissions and thermal concerns, maintaining signal integrity, and optimizing overall radar system performance.

Figure 3-1 depicts TI’s LoP package technology. Silicon die sits within the package mold compound and RF signals propagate from die bumps through the package substrate to the radiating element. The radiating element directly radiates into the 3D antenna via a waveguide through the PCB. TI LoP technology enables direct signal transfer from the package to the antenna, contrasting the traditional MMIC packages which first transition a signal to the PCB and then to the antenna. The launch is embedded into the package bottom layer and the BGA balls around the launch provide RF shielding of the signals as the signals are propagated into the 3D antenna through the PCB waveguide holes.