TIDUEZ3B april   2021  – april 2023

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG342xR030
      2. 2.3.2 TMS320F28002x
      3. 2.3.3 OPA607
      4. 2.3.4 UCC21222
  8. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 Test Procedures
      2. 3.3.2 Performance Data: Efficiency, iTHD, and Power Factor
      3. 3.3.3 Functional Waveforms
        1. 3.3.3.1 Current Sensing and Protection
        2. 3.3.3.2 Power Stage Start-Up and Input Waveforms
        3. 3.3.3.3 AC Drop Test
        4. 3.3.3.4 Surge Test
        5. 3.3.3.5 EMI Test
      4. 3.3.4 Thermal Test
      5. 3.3.5 GaN FET Switching Waveform
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Documentation Support
    3. 4.3 Support Resources
    4. 4.4 Trademarks
  10. 5About the Author
  11. 6Revision History

3.3.3.5 EMI Test

This reference design must deal with EMI CE, there is a 1.1-MHz and 5.5-MHz CM noise which can be suppressed with an shielding on PFC choke. Figure 3-19 shows the board CE test result after adding a shielding copper to the PFC choke at 230 VAC and 40-R resistance load.


GUID-20210309-CA0I-BDTV-5LHD-C55MB0VPZT9Q-low.gif

Figure 3-19 EMI CE Result After Adding Shielding Copper with 230 Vac, 40-R Load
Note: This reference design must deal with EMI CE, there is a 1.1-MHz and 5.5-MHz CM noise which can be suppressed with a shielding on PFC choke. Figure 3-19 shows the board CE performance after adding a shielding copper to the PFC choke with 230 VAC and 40-R resistance load.