CD74FCT374

ACTIVO

Flip flops octales tipo D con Interfaz lógica BiCMOS FCT con salidas de 3 estados

Detalles del producto

Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 48 IOH (max) (mA) -15 Supply current (max) (µA) 80 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 70 IOL (max) (mA) 48 IOH (max) (mA) -15 Supply current (max) (µA) 80 Features Very high speed (tpd 5-10ns) Operating temperature range (°C) 0 to 70 Rating Catalog
SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • BiCMOS Technology With Low Quiescent Power
  • 3-State Outputs Drive Bus Lines Directly
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 48-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP
  • BiCMOS Technology With Low Quiescent Power
  • 3-State Outputs Drive Bus Lines Directly
  • Buffered Inputs
  • Noninverted Outputs
  • Input/Output Isolation From VCC
  • Controlled Output Edge Rates
  • 48-mA Output Sink Current
  • Output Voltage Swing Limited to 3.7 V
  • SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
  • Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP

The CD74FCT374 is an octal, edge-triggered, D-type flip-flop that uses a small-geometry BiCMOS technology and features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 48 mA.

The eight flip-flops enter data into their registers on the low-to-high transition of the clock (CLK). The output-enable (OE\) input controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.

A buffered OE\ input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT374 is characterized for operation from 0°C to 70°C.

The CD74FCT374 is an octal, edge-triggered, D-type flip-flop that uses a small-geometry BiCMOS technology and features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 48 mA.

The eight flip-flops enter data into their registers on the low-to-high transition of the clock (CLK). The output-enable (OE\) input controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.

A buffered OE\ input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The CD74FCT374 is characterized for operation from 0°C to 70°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet BiCMOS Octal Edge-Triggered D-Type Flip-Flop With 3-State Outputs datasheet 03 jul 2000
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 dic 2022
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación 14-24-LOGIC-EVM (EVM) está diseñado para admitir cualquier dispositivo lógico que esté en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

Guía del usuario: PDF | HTML
Paquete Pasadores Descargar
SOIC (DW) 20 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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