Inicio Gestión de la energía Power stages Si power stages

CSD95472Q5MC

ACTIVO

20 V 60 A SON 5 x 6 mm DualCool síncrono reductor NexFET™ etapa de potencia

Detalles del producto

VDS (V) 20 Ploss current (A) 30
VDS (V) 20 Ploss current (A) 30
VSON-CLIP (DMC) 12 30 mm² 6 x 5
  • 60-A Continuous Operating Current Capability
  • 94.4% System Efficiency at 1.2 V / 30 A
  • Low Power Loss of 2.3 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature-Compensated Bidirectional Current
    Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and
      Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Deadtime for Shoot-Through Protection
  • High-Density SON 5 × 6 mm Footprint
  • Ultralow Inductance Package
  • System-Optimized PCB Footprint
  • DualCool™ Packaging
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 60-A Continuous Operating Current Capability
  • 94.4% System Efficiency at 1.2 V / 30 A
  • Low Power Loss of 2.3 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature-Compensated Bidirectional Current
    Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and
      Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Deadtime for Shoot-Through Protection
  • High-Density SON 5 × 6 mm Footprint
  • Ultralow Inductance Package
  • System-Optimized PCB Footprint
  • DualCool™ Packaging
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95472Q5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95472Q5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Documentación técnica

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* Data sheet CSD95472Q5MC Synchronous Buck NexFET Smart Power Stage datasheet PDF | HTML 12 feb 2016

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

CSD95472Q5MC PSpice Transient Model

SLPM172.ZIP (24 KB) - PSpice Model
Diseños de referencia

PMP20176 — Diseño de referencia de 4 fases y 140 A para FPGA Intel Stratix 10 GX

This reference design focuses on providing a compact, high-performance, multiphase solution suitable for powering Intel® Stratix® 10 GX field-programmable gate arrays (FPGAs) with a specific focus on the SG2800-I1V variant. Integrated PMBus™ allows for easy output voltage setting and (...)
Test report: PDF
Esquema: PDF
Paquete Pasadores Descargar
VSON-CLIP (DMC) 12 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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