Detalles del producto

Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
COG (NBP) 56 42.88726 mm² 5.321 x 8.06
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

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Documentación técnica

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Tipo Título Fecha
* Data sheet OPT8320 3D Time-of-Flight Sensor (Short) datasheet 24 abr 2018
E-book E-book: An engineer’s guide to industrial robot designs 12 feb 2020
EVM User's guide OPT8320-CDK-EVM User's Guide (Rev. A) 02 feb 2017
Application note Sensor Optics Selection Guide for 3D ToF Camera Systems PDF | HTML 22 jul 2016
White paper Filtering for 3D Time-of-Flight Sensors 21 ene 2016
Design guide Introduction to Time-of-Flight (ToF) System Design (Rev. D) 13 may 2014
White paper Introduction to Time-of-Flight Camera (Rev. B) 07 may 2014

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

OPT8320 IBIS Model

SBAM256.ZIP (88 KB) - IBIS Model
Herramienta de cálculo

SBAC124 3D ToF System Estimator Tool

lock = Requiere aprobación de exportación (1 minuto)
Productos y hardware compatibles

Productos y hardware compatibles

Productos
Sensores de tiempo de vuelo (ToF)
OPT8241 Sensor 3D de tiempo de vuelo (ToF) de resolución QVGA OPT8320 Sensor 3D de tiempo de vuelo (ToF) y controlador OPT9221 Controlador de tiempo de vuelo (ToF) para OPT8241
Paquete Pasadores Descargar
COG (NBP) 56 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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