Inicio Lógica y traducción de voltaje Búferes, controladores y transceptores Búferes y controladores inversores
Inicio
Lógica y traducción de voltaje
Búferes, controladores y transceptores
Búferes y controladores inversores

SN74AUP3G14

ACTIVO

Inversores de baja potencia, 3 canales, 0.8 V a 3.6 V con entradas de disparador Schmitt

Haga su pedido ahora
Hoja de datos

SN74AUP3G14

ACTIVO
Hoja de datos Haga su pedido ahora

Detalles del producto

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 3 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 3 IOL (max) (mA) 4 IOH (max) (mA) -4 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 8 1.8 mm² 1 x 1.8 UQFN (RSE) 8 2.25 mm² 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm² 2 x 3.1 X2SON (DQE) 8 1.4 mm² 1.4 x 1
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments.
  • Available in the Texas Instruments NanoStar Package
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments.

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.

The SN74AUP3G14 contains three inverters and performs the Boolean function Y = A. The device functions as three independent inverters but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.

The SN74AUP3G14 contains three inverters and performs the Boolean function Y = A. The device functions as three independent inverters but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
open-in-new Buscar otro/a Búferes y controladores inversores
Descargar Ver vídeo con transcripción Video

Productos similares que pueden interesarle

open-in-new Comparar alternativas
Pin por pin con la misma funcionalidad que el dispositivo comparado
SN74LVC3G04 ACTIVO Inversores de 3 canales, 1.65 V a 5.5 V Larger voltage range (1.65V to 5.5V), higher drive average drive strength (24mA)
Funcionalidad similar a la del dispositivo comparado
SN74LVC3G14 ACTIVO Inversores de 3 canales, 1.65 V a 5.5 V con entradas de disparador Schmitt Larger voltage range (1.65V to 5.5V), higher drive average drive strength (24mA)

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 6
Tipo Título Fecha
* Data sheet SN74AUP3G14 Low-Power Triple Schmitt-Trigger Inverter datasheet (Rev. D) 23 ago 2012
Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 may 2019
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación lógica genérico para encapsulados DCK, DCT, DCU, DRL y DBV de 5 a 8 pines

Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
Guía del usuario: PDF
No disponible en TI.com
Modelo de simulación

SN74AUP3G14 Behavioral SPICE Model

SCEM665.ZIP (7 KB) - PSpice Model
Descargar
Diseños de referencia

TIDA-00751 — Diseño de referencia del conmutador de relé de estado sólido de 24 VCA con aislamiento galvánico

The solid state relay 24V AC Switch reference design is a single relay replacement that enables efficient power management for a low power alternative to standard electromechanical relays.  The OFF-mode provides energy to the system controller and the ON mode can switch fast enough to allow (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-010005 — Diseño de referencia del módulo de detección del marcapasos cardíaco configurable por software

This reference design implements a compact hardware-based circuit to detect the pacemaker pulse during ECG measurement. It provides indication of valid pace signal through a flag and onboard LED. This design enables the user to configure various parameters of the pace signal (amplitude, rise time, (...)
Design guide: PDF
Esquema: PDF
Paquete Pasadores Descargar
DSBGA (YFP) 8 Ver opciones
UQFN (RSE) 8 Ver opciones
VSSOP (DCU) 8 Ver opciones
X2SON (DQE) 8 Ver opciones
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

Ver todos los temas del foro en inglés

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos