SN74AVC2T45

ACTIVO

Transceptor de bus de alimentación doble de 2 bits con traducción de tensión configurable y salidas

Se encuentra disponible una versión más nueva de este producto

open-in-new Comparar alternativas
Reemplazo con funcionalidad mejorada del dispositivo comparado
SN74AXC2T45 ACTIVO Transceptor de bus de alimentación doble de 2 bits con traducción de tensión configurable Pin-to-pin upgrade with a wider voltage range and improved performance

Detalles del producto

Technology family AVC Applications I2S Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 20 Features Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AVC Applications I2S Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 20 Features Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 SSOP (DCT) 8 11.8 mm² 2.95 x 4 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Available in the Texas Instruments NanoFree™ Package
  • VCC Isolation Feature: If Either VCC Input Is at GND, Both Ports Are in the High-Impedance State
  • Dual Supply Rail Design
  • I/Os Are 4.6-V Over Voltage Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • Max Data Rates
    • 500 Mbps (1.8 V to 3.3 V)
    • 320 Mbps (<1.8 V to 3.3 V )
    • 320 Mbps (Level-Shifting to 2.5 V or 1.8 V)
    • 280 Mbps (Level-Shifting to 1.5 V)
    • 240 Mbps (Level-Shifting to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
  • Available in the Texas Instruments NanoFree™ Package
  • VCC Isolation Feature: If Either VCC Input Is at GND, Both Ports Are in the High-Impedance State
  • Dual Supply Rail Design
  • I/Os Are 4.6-V Over Voltage Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • Max Data Rates
    • 500 Mbps (1.8 V to 3.3 V)
    • 320 Mbps (<1.8 V to 3.3 V )
    • 320 Mbps (Level-Shifting to 2.5 V or 1.8 V)
    • 280 Mbps (Level-Shifting to 1.5 V)
    • 240 Mbps (Level-Shifting to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22

This 2-bit non-inverting bus transceiver uses two separate configurable power-supply rails. The A ports are designed to track VCCA and accepts any supply voltage from 1.2 V to 3.6 V. The B ports are designed to track VCCB and accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation and level-shifting between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.

The SN74AVC2T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR pin) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess leakage current on the internal CMOS structure.

This 2-bit non-inverting bus transceiver uses two separate configurable power-supply rails. The A ports are designed to track VCCA and accepts any supply voltage from 1.2 V to 3.6 V. The B ports are designed to track VCCB and accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation and level-shifting between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.

The SN74AVC2T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR pin) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess leakage current on the internal CMOS structure.

Descargar Ver vídeo con transcripción Video

Productos similares que pueden interesarle

open-in-new Comparar alternativas
Pin por pin con la misma funcionalidad que el dispositivo comparado
TXU0102 ACTIVO Conmutador de nivel de dirección fija de 2 canales con canales en la misma dirección 2 channel fixed direction level translator
TXU0202 ACTIVO Conmutador de nivel y dirección fija de dos canales con canales en dirección opuesta 2 channel fixed direction level translator

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 17
Tipo Título Fecha
* Data sheet SN74AVC2T45 2-Bit, Dual Supply, Bus Transceiver With Configurable Level-Shifting and Translation datasheet (Rev. L) PDF | HTML 18 may 2017
Application brief Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages PDF | HTML 05 sep 2023
EVM User's guide Generic AVC and LVC Direction Controlled Translation EVM (Rev. B) 30 jul 2021
Selection guide Voltage Translation Buying Guide (Rev. A) 15 abr 2021
EVM User's guide SN74AXC2T-SMALLPKGEVM Evaluation module user's guide 04 jun 2019
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
Application note Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B) 30 abr 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
More literature LCD Module Interface Application Clip 09 may 2003
User guide AVC Advanced Very-Low-Voltage CMOS Logic Data Book, March 2000 (Rev. C) 20 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B) 07 jul 1999
Application note AVC Logic Family Technology and Applications (Rev. A) 26 ago 1998

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación lógica genérico para encapsulados DCK, DCT, DCU, DRL y DBV de 5 a 8 pines

Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
Guía del usuario: PDF
Placa de evaluación

AVCLVCDIRCNTRL-EVM — EVM genérico para dispositivo de traducción bidireccional controlado por dirección compatible con AV

The generic EVM is designed to support one, two, four and eight channel LVC and AVC direction-controlled translation devices. It also supports the bus hold and automotive -Q1 devices in the same number of channels. The AVC are low voltage translation devices with lower drive strength of 12mA. LVC (...)

Guía del usuario: PDF
Placa de evaluación

AXC2T-SMALLPKGEVM — Módulo de evaluación de paquete pequeño AXC2T para dispositivos de paquete DTM y RSW

This EVM is designed to support DTM and RSW packages for the AXC and LVC family of DIR controlled bidirectional devices. The AXC and AVC devices belong to the low voltage direction controlled translation family with operating voltage from 0.65V to 3.6V (AXC) and 1.2 to 3.6 (AVC) with 12mA of drive (...)
Guía del usuario: PDF
Controlador o biblioteca

CC256XMS432BTBLESW — Pila Bluetooth de modo dual TI en MCU MSP432

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
Guía del usuario: PDF
Modelo de simulación

SN74AVC2T45 IBIS Model (Rev. B)

SCEM431B.ZIP (122 KB) - IBIS Model
Diseños de referencia

TIDC-CC3200-VIDEO — Diseño de referencia de transmisión de video/audio SimpleLink™ CC32xx-OV788 a través de Wi-Fi

The design enables OV788 ultra-low power video compression chip users to bring live streaming capabilities of audio and video data over Wi-Fi® very easily. It showcases a single chip implementation of RTP video streaming + Wi-Fi connection on the SimpleLink™ CC3200 Wi-Fi wireless (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

DLP4500-C350REF — Diseño de referencia de dirección de luz portátil de alta resolución con tecnología DLP

This reference design, featuring the DLP® 0.45” WXGA chipset and implemented in the DLP® LightCrafter™ 4500 evaluation module (EVM), enables flexible control of high resolution, accurate patterns for industrial, medical, and scientific applications. With a free USB-based GUI and (...)
Test report: PDF
Esquema: PDF
Diseños de referencia

TIDA-00254 — Generación precisa de nube de puntos para aplicaciones de visión de máquinas 3D con tecnología DLP&r

The 3D Machine Vision reference design employs Texas Instruments DLP® Advanced Light Control Software Development Kit (SDK) for LightCrafter™ series controllers, which allows developers to easily construct 3D point clouds by integrating TI’s digital micromirror device (DMD) (...)
Test report: PDF
Esquema: PDF
Paquete Pasadores Descargar
DSBGA (YZP) 8 Ver opciones
SSOP (DCT) 8 Ver opciones
VSSOP (DCU) 8 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos