TLV5630

ACTIVO

DAC en serie de 8 canales, de 2.7 V a 5.5 V, 12 bits, con referencia integrada

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Detalles del producto

Resolution (Bits) 12 Number of DAC channels 8 Interface type SPI Output type Buffered Voltage Settling time (µs) 1 Features SDO Reference type Ext, Int Architecture String Rating Catalog Output range (max) (mA/V) 5.1 Output range (min) (mA/V) 0 Sample/update rate (Msps) 0.283 Power consumption (typ) (mW) 18 Operating temperature range (°C) -40 to 85
Resolution (Bits) 12 Number of DAC channels 8 Interface type SPI Output type Buffered Voltage Settling time (µs) 1 Features SDO Reference type Ext, Int Architecture String Rating Catalog Output range (max) (mA/V) 5.1 Output range (min) (mA/V) 0 Sample/update rate (Msps) 0.283 Power consumption (typ) (mW) 18 Operating temperature range (°C) -40 to 85
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 TSSOP (PW) 20 41.6 mm² 6.5 x 6.4
  • Eight Voltage Output DACs in One Package
    • TLV5630 . . .12-Bit
    • TLV5631 . . .10-Bit
    • TLV5632 . . .8-Bit
    • 1 µs in Fast Mode
    • 3 µs in Slow Mode
  • Programmable Settling Time vs Power
    Consumption
    • 1 µs in Fast Mode
    • 3 µs in Slow Mode
    • 18 mW in Slow Mode at 3 V
    • 48 mW in Fast Mode at 3 V
  • Compatible With TMS320 and SPI Serial Ports
  • Monotonic Over Temperature
  • Low Power Consumption:
    • 18 mW in Slow Mode at 3 V
    • 48 mW in Fast Mode at 3 V
  • Power-Down Mode
  • Internal Reference
  • Data Output for Daisy-Chaining
  • APPLICATIONS
    • Digital Servo Control Loops
    • Digital Offset and Gain Adjustment
    • Industrial Process Control
    • Machine and Motion Control Devices
    • Mass Storage Devices
  • Eight Voltage Output DACs in One Package
    • TLV5630 . . .12-Bit
    • TLV5631 . . .10-Bit
    • TLV5632 . . .8-Bit
    • 1 µs in Fast Mode
    • 3 µs in Slow Mode
  • Programmable Settling Time vs Power
    Consumption
    • 1 µs in Fast Mode
    • 3 µs in Slow Mode
    • 18 mW in Slow Mode at 3 V
    • 48 mW in Fast Mode at 3 V
  • Compatible With TMS320 and SPI Serial Ports
  • Monotonic Over Temperature
  • Low Power Consumption:
    • 18 mW in Slow Mode at 3 V
    • 48 mW in Fast Mode at 3 V
  • Power-Down Mode
  • Internal Reference
  • Data Output for Daisy-Chaining
  • APPLICATIONS
    • Digital Servo Control Loops
    • Digital Offset and Gain Adjustment
    • Industrial Process Control
    • Machine and Motion Control Devices
    • Mass Storage Devices

The TLV5630, TLV5631, and TLV5632 are pin-compatible, eight-channel, 12-/10-/8-bit voltage output DACs each with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.

Additional features are a power-down mode, an LDAC input for simultaneous update of all eight DAC outputs, and a data output which can be used to cascade multiple devices, and an internal programmable band-gap reference.

The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed vs power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage.

Implemented with a CMOS process, the DACs are designed for single-supply operation from 2.7 V to 5.5 V, and can operate on two separate analog and digital power supplies. The devices are available in 20-pin SOIC and TSSOP packages.

The TLV5630, TLV5631, and TLV5632 are pin-compatible, eight-channel, 12-/10-/8-bit voltage output DACs each with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.

Additional features are a power-down mode, an LDAC input for simultaneous update of all eight DAC outputs, and a data output which can be used to cascade multiple devices, and an internal programmable band-gap reference.

The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed vs power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage.

Implemented with a CMOS process, the DACs are designed for single-supply operation from 2.7 V to 5.5 V, and can operate on two separate analog and digital power supplies. The devices are available in 20-pin SOIC and TSSOP packages.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 8-Channel, 12-/10-/8-Bit, 2.7-V to 5.5-V, Low Power DAC with Power Down datasheet (Rev. F) 14 nov 2008

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Herramienta de cálculo

ANALOG-ENGINEER-CALC — Calculadora para ingenieros analógicos

The analog engineer’s calculator is designed to speed up many of the repetitive calculations that analog circuit design engineers use on a regular basis. This PC-based tool provides a graphical interface with a list of various common calculations ranging from setting operational-amplifier (...)
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Herramienta de simulación

TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
Paquete Pasadores Descargar
SOIC (DW) 20 Ver opciones
TSSOP (PW) 20 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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