DRV8808
COMBO モーター・ドライバ、DC-DC コンバータ付
DRV8808
- Three DC Motor Drivers
- Up to 2.5-A Current Chopping
- Low Typical ON Resistance (RDSON = 0.5 Ω at TJ = 25°C)
- Three Integrated DC-DC Converters
- ON/OFF Selectable Using CSELECT Pin and Serial Interface
- Outputs Configurable With External Resistor Network From 1 V to 90% of VM Capability for All Three Channels
- 1.35-A Output Capability for All Three Channels
- One Integrated LDO Regulator
- Output Configurable With External Resistor Network from 1 V to 2.5 V
- 550-mA Output Capability
- 7-V to 40-V Operating Range
- Serial Interface for Communications
- Thermally Enhanced Surface-Mount Package
48-Pin HTSSOP With PowerPAD
(Eco-Friendly: RoHS and No Sb/Br ) - Power-Down Function (Deep-Sleep Mode)
- Reset Signal Output (Active Low)
- Reset (All Clear) Control Input
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
The DRV8808 device provides the integrated motor driver solution for printers. The chip has three full H-bridges and three buck DC-DC converters.
The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings. The device can be configured to use internal or external current sense for winding current control.
The SPI input pins are 3.3-V compatible and have inputs that are 5-V tolerant.
The DRV8808 has three DC-DC switched-mode buck converters to generate a programmable output voltage from 1 V up to 90% of VM, with up to 1.35-A load current capability.
The device is configured using the CSELECT terminal at start-up, and serial interface during run time.
An internal shutdown function is provided for overcurrent protection, short-circuit protection, undervoltage lockout, and thermal shutdown. Also, the device has the reset function at power on, and the input on the nReset pin.
技術資料
| 種類 | タイトル | 最新の英語版をダウンロード | 日付 | |||
|---|---|---|---|---|---|---|
| * | データシート | DRV8808 Combination Motor Driver With DC-DC Converter データシート (Rev. B) | PDF | HTML | 2015年 1月 31日 | ||
| アプリケーション・ノート | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||||
| アプリケーション概要 | PowerPAD™ Made Easy (Rev. B) | 2004年 5月 12日 |
設計と開発
その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。
| パッケージ | ピン数 | ダウンロード |
|---|---|---|
| HTSSOP (DCA) | 48 | オプションの表示 |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 材質成分
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点