제품 상세 정보

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type TTL Output type CMOS Features Balanced outputs, Positive input clamp diode, Very high speed (tpd 5-10ns) Technology family ACT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type TTL Output type CMOS Features Balanced outputs, Positive input clamp diode, Very high speed (tpd 5-10ns) Technology family ACT Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35
  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • Independent Registers for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • Inputs Are TTL-Voltage Compatible
  • Independent Registers for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings

 

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'ACT16646 are 16-bit bus transceivers consisting of D-type flip-flops and control circuitry with 3-state outputs arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. The devices can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the bus transceivers and registers.

Output-enable and direction-control (DIR) inputs are provided to control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either register or in both. The select controls (SAB and SBA) can multiplex stored and real-time (transparent mode) data. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data. DIR determines which bus receives data when is low. In the isolation mode ( high), A data may be stored in one register and/or B data may be stored in the other register.

When an output function is disabled, the input function is still enabled and may be used to store and transmit data. Only one of the two buses, A or B, may be driven at a time.

The 74ACT16646 is packaged in TI's shrink small-outline package, which provides twice the functionality of standard small-outline packages in the same printed-circuit-board area.

The 54ACT16646 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16646 is characterized for operation from -40°C to 85°C.

 

The 'ACT16646 are 16-bit bus transceivers consisting of D-type flip-flops and control circuitry with 3-state outputs arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. The devices can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the bus transceivers and registers.

Output-enable and direction-control (DIR) inputs are provided to control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either register or in both. The select controls (SAB and SBA) can multiplex stored and real-time (transparent mode) data. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data. DIR determines which bus receives data when is low. In the isolation mode ( high), A data may be stored in one register and/or B data may be stored in the other register.

When an output function is disabled, the input function is still enabled and may be used to store and transmit data. Only one of the two buses, A or B, may be driven at a time.

The 74ACT16646 is packaged in TI's shrink small-outline package, which provides twice the functionality of standard small-outline packages in the same printed-circuit-board area.

The 54ACT16646 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74ACT16646 is characterized for operation from -40°C to 85°C.

 

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
SN74ACT245 활성 TTL 호환 CMOS 입력 및 3상 출력을 지원하는 옥탈 버스 트랜시버 Voltage range (4.5V to 5.5V), average drive strength (24mA), average propagation delay (8ns)

기술 문서

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모두 보기11
유형 직함 날짜
* Data sheet 16-Bit Bus Transceivers And Registers With 3-State Outputs datasheet (Rev. B) 1996/04/01
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

설계 및 개발

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패키지 다운로드
SSOP (DL) 56 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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