CD54ACT574
- Buffered inputs
- Typical propagation delay:
6.5 ns @ VCC = 5 V, TA = 25°C, CL = 50 pF - Exceeds 2-kV ESD Protection - MIL-STD-883, Method 3015
- SCR-Latchup-resistant CMOS process and circuit design
- Speed of bipolar FAST*/AS/S with significantly reduced power consumption
- Balanced propagation delays
- AC types feature 1.5-V to 5.5-V operation and balanced noise immunity at 30% of the supply
- ±24-mA output drive current
-Fanout to 15 FAST* ICs
-Drives 50-ohm transmission lines - Characterized for operation from –40° to 85°C
*FAST is a Registered Trademark of Fairchild Semiconductor Corp.
The RCA-CD54/74AC564 and CD54/74AC574 and the CD54/74ACT564 and CD54/74ACT574 octal D-type, 3-state, positive-edge-triggered flip-flops use the RCA ADVANCED CMOS technology. The eight flip-flops enter data into their registers on the LOW-to-HIGH transition of the clock (CP). The Output Enable (OE\) controls the 3-state outputs and is independent of the register operation. When the Output Enable (OE\) is HIGH, the outpus are in the high-impendance state. The CD54/74AC/ACT564 and CD54/74AC/ACT574 share the same pin configurations; the CD54/74AC/ACT564, however, has inverted outputs and the CD54/74AC/ACT574 has non-inverted outputs.
The CD74AC/ACT564 and CD74AC/ACT574 are supplied in 20-lead dual-in-line plastic packages (E suffix) and in 20-lead dual-in-line small-outline plastic pakcages (M suffix). Both package types are operable over the following temperature range: Commercial (0- to 70°C); Industrial (-40 to +85°C); and Extended Industrial/Military (-55 to +125°C).
The CD54AC/ACT564 and CD54AC/ACT574, available in chip form (H suffix), are operable over the -55 to +125°C temperature range.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Octal D-Type Flip-Flop, 3-State datasheet | 1998/12/03 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997/06/01 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996/04/01 |
설계 및 개발
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치