CY54FCT827T
- Function, Pinout, and Drive Compatible With FCT, F, and AM29827 Logic
- Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- 3-State Outputs
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- CY54FCT827T
- 32-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT827T
- 64-mA Output Sink Current
- 32-mA Output Source Current
The \x92FCT827T devices are 10-bit bus drivers that provide high-performance bus-interface buffering for wide data/address paths or buses carrying parity. The 10-bit buffers have NANDed output enables for maximum control flexibility. The \x92FCT827T devices are designed for high-capacitance-load drive capability, while providing low-capacitance bus loading at both inputs and outputs. All outputs are designed for low-capacitance bus loading in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
기술 문서
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모두 보기8 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 10-Bit Buffers With 3-State Outputs datasheet (Rev. A) | 2001/10/01 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
| User guide | CYFCT Parameter Measurement Information | 2001/04/02 | ||
| Selection guide | Advanced Bus Interface Logic Selection Guide | 2001/01/09 |
설계 및 개발
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주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치