SN54AS823A
- Functionally Equivalent to AMD's AM29823 and AM29824
- Provide Extra Data Width Necessary for Wider Address/Data Paths or Buses With Parity
- Outputs Have Undershoot-Protection Circuitry
- Power-Up High-Impedance State
- Buffered Control Inputs to Reduce dc Loading Effects
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs
These 9-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers, parity bus interfacing, and working registers.
With the clock-enable (
)
input low, the nine D-type edge-triggered flip-flops enter data on
the low-to-high transitions of the clock (CLK) input. Taking high disables the clock buffer,
latching the outputs. The SN54AS823A and SN74AS823A have noninverting
data (D) inputs and the SN74AS824A has inverting (D\) inputs. Taking
the clear (
) input low
causes the nine Q outputs to go low independently of the clock.
A buffered output-enable (
) input can be used to place the nine outputs in either
a normal logic state (high or low logic level) or the high-
impedance state. In the high-impedance state, the outputs neither
load nor drive the bus lines significantly. The high-impedance state
and increased drive provide the capability to drive bus lines without
interface or pullup components.
does not affect
the internal operation of the flip-flops. Old data can be retained or
new data can be entered while the outputs are in the high-impedance
state.
The SN54AS823A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AS823A and SN74AS824A are characterized for operation from 0°C to 70°C.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 9-Bit Bus Interface Flip-Flops With 3-State Outputs datasheet (Rev. A) | 1995/08/01 | |
| * | SMD | SN54AS823A SMD 5962-89525 | 2016/06/21 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Advanced Schottky Load Management | 1997/02/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 | ||
| Application note | Advanced Schottky (ALS and AS) Logic Families | 1995/08/01 |
설계 및 개발
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치