홈 로직 및 전압 변환 플립플롭, 래치 및 레지스터 D형 플립플롭
홈
로직 및 전압 변환
플립플롭, 래치 및 레지스터
D형 플립플롭

SN54LVC74A

활성

클리어 및 프리셋을 지원하는 듀얼 양극 에지 트리거 D형 플립플롭

지금 주문
데이터시트

SN54LVC74A

활성
데이터시트 지금 주문

제품 상세 정보

Number of channels 2 Technology family LVC Supply voltage (min) (V) 2 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 100 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 2 Technology family LVC Supply voltage (min) (V) 2 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 100 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 14 130.4652 mm² 19.56 x 6.67 CFP (W) 14 58.023 mm² 9.21 x 6.3 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Operate From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Maximum tpd of 5.2 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)
  • Operate From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Maximum tpd of 5.2 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)

The SNx4LVC74A devices integrate two positive-edge triggered D-type flip-flops in one convenient device.

The SN54LVC74A is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC74A is designed for 1.65-V to 3.6-V VCC operation.

A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

The data I/Os and control inputs are overvoltage tolerant. This feature allows the use of these devices for down-translation in a mixed-voltage environment.

The SNx4LVC74A devices integrate two positive-edge triggered D-type flip-flops in one convenient device.

The SN54LVC74A is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC74A is designed for 1.65-V to 3.6-V VCC operation.

A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

The data I/Os and control inputs are overvoltage tolerant. This feature allows the use of these devices for down-translation in a mixed-voltage environment.
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기술 문서

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모두 보기29
유형 직함 날짜
* Data sheet SNx4LVC74A Dual Positive-Edge-Triggered D-Type Flip-Flops With Clear and Preset datasheet (Rev. U) PDF | HTML 2017/01/04
* SMD SN54LVC74A SMD 5962-97616 2016/06/21
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 2003/11/06
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 2002/12/18
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 2002/03/27
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note LVC Characterization Information 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Design guide Low-Voltage Logic (LVC) Designer's Guide 1996/09/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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패키지 핀 다운로드
CDIP (J) 14 옵션 보기
CFP (W) 14 옵션 보기
LCCC (FK) 20 옵션 보기
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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