제품 상세 정보

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
LQFP (PM) 64 144 mm² 12 x 12
  • Member of the Texas Instruments Widebus™ Family
  • Compatible With IEEE Std 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture
  • Includes D-Type Flip-Flops and Control Circuitry to Provide Multiplexed Transmission of Stored and Real-Time Data
  • Two Boundary-Scan Cells Per I/O for Greater Flexibility
  • SCOPE™ Instruction Set
    • IEEE Std 1149.1-1990 Required Instructions, Optional INTEST, and P1149.1A CLAMP and HIGHZ
    • Parallel Signature Analysis at Inputs With Masking Option
    • Pseudorandom Pattern Generation From Outputs
    • Sample Inputs/Toggle Outputs
    • Binary Count From Outputs
    • Device Identification
    • Even-Parity Opcodes

SCOPE and Widebus are trademarks of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • Compatible With IEEE Std 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture
  • Includes D-Type Flip-Flops and Control Circuitry to Provide Multiplexed Transmission of Stored and Real-Time Data
  • Two Boundary-Scan Cells Per I/O for Greater Flexibility
  • SCOPE™ Instruction Set
    • IEEE Std 1149.1-1990 Required Instructions, Optional INTEST, and P1149.1A CLAMP and HIGHZ
    • Parallel Signature Analysis at Inputs With Masking Option
    • Pseudorandom Pattern Generation From Outputs
    • Sample Inputs/Toggle Outputs
    • Binary Count From Outputs
    • Device Identification
    • Even-Parity Opcodes

SCOPE and Widebus are trademarks of Texas Instruments.

This scan test device with a 18-bit bus transceiver and register is a member of the Texas Instruments SCOPE™ testability IC family. This device supports IEEE Std 1149.1-1990 boundary scan to facilitate testing of complex circuit board assemblies. Scan access to the test circuitry is accomplished via the four-wire test access port (TAP) interface.

In the normal mode, this device is an 18-bit bus transceiver and register that allows for multiplexed transmission of data directly from the input bus or from the internal registers. It can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self-test on the boundary test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPE bus transceivers and registers.

Transceiver function is controlled by output-enable (OE)\ and direction (DIR) inputs. When (OE)\ is low, the transceiver is active and operates in the A-to-B direction when DIR is high or in the B-to-A direction when DIR is low. When (OE)\ is high, both the A and B outputs are in the high-impedance state, effectively isolating both buses.

Data flow is controlled by clock (CLKAB and CLKBA) and select (SAB and SBA) inputs. Data on the A bus is clocked into the associated registers on the low-to-high transition of CLKAB. When SAB is low, real-time A data is selected for presentation to the B bus (transparent mode). When SAB is high, stored A data is selected for presentation to the B bus (registered mode). The function of the CLKBA and SBA inputs mirrors that of CLKAB and SAB, respectively. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the SN74ABT18646.

In the test mode, the normal operation of the SCOPE bus transceivers and registers is inhibited, and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry can perform boundary scan test operations according to the protocol described in IEEE Std 1149.1-1990.

Four dedicated test pins are used to observe and control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry can perform other testing functions, such as parallel signature analysis on data inputs and pseudorandom pattern generation from data outputs. All testing and scan operations are synchronized to the TAP interface.

Additional flexibility is provided in the test mode through the use of two boundary scan cells (BSCs) for each I/O pin. This allows independent test data to be captured and forced at either bus (A or B). A PSA/COUNT instruction is also included to ease the testing of memories and other circuits where a binary count addressing scheme is useful.

This scan test device with a 18-bit bus transceiver and register is a member of the Texas Instruments SCOPE™ testability IC family. This device supports IEEE Std 1149.1-1990 boundary scan to facilitate testing of complex circuit board assemblies. Scan access to the test circuitry is accomplished via the four-wire test access port (TAP) interface.

In the normal mode, this device is an 18-bit bus transceiver and register that allows for multiplexed transmission of data directly from the input bus or from the internal registers. It can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self-test on the boundary test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPE bus transceivers and registers.

Transceiver function is controlled by output-enable (OE)\ and direction (DIR) inputs. When (OE)\ is low, the transceiver is active and operates in the A-to-B direction when DIR is high or in the B-to-A direction when DIR is low. When (OE)\ is high, both the A and B outputs are in the high-impedance state, effectively isolating both buses.

Data flow is controlled by clock (CLKAB and CLKBA) and select (SAB and SBA) inputs. Data on the A bus is clocked into the associated registers on the low-to-high transition of CLKAB. When SAB is low, real-time A data is selected for presentation to the B bus (transparent mode). When SAB is high, stored A data is selected for presentation to the B bus (registered mode). The function of the CLKBA and SBA inputs mirrors that of CLKAB and SAB, respectively. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the SN74ABT18646.

In the test mode, the normal operation of the SCOPE bus transceivers and registers is inhibited, and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry can perform boundary scan test operations according to the protocol described in IEEE Std 1149.1-1990.

Four dedicated test pins are used to observe and control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry can perform other testing functions, such as parallel signature analysis on data inputs and pseudorandom pattern generation from data outputs. All testing and scan operations are synchronized to the TAP interface.

Additional flexibility is provided in the test mode through the use of two boundary scan cells (BSCs) for each I/O pin. This allows independent test data to be captured and forced at either bus (A or B). A PSA/COUNT instruction is also included to ease the testing of memories and other circuits where a binary count addressing scheme is useful.

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
74ACT16861 활성 3상 출력을 지원하는 20비트 버스 트랜시버 Longer propagation delay (8ns), lower average drive strength (24mA)

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
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모두 보기21
유형 직함 날짜
* Data sheet Scan Test Devices With 18-Bit Bus Transceivers And Registers datasheet (Rev. A) 2002/01/29
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
EVM User's guide LASP Demo Board User's Guide 2005/11/01
Application note Programming CPLDs Via the 'LVT8986 LASP 2005/11/01
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 2004/02/16
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997/03/01
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

시뮬레이션 모델

BSDL Model of SN74ABT18646

SCTM015.ZIP (3 KB) - BSDL Model
시뮬레이션 모델

SN74ABT18646 IBIS Model (Rev. A)

SCBM021A.ZIP (15 KB) - IBIS Model
패키지 다운로드
LQFP (PM) 64 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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