홈 로직 및 전압 변환 플립플롭, 래치 및 레지스터 D형 플립플롭
홈
로직 및 전압 변환
플립플롭, 래치 및 레지스터
D형 플립플롭

SN74AHC16374

활성

3상 출력을 지원하는 16비트 에지 트리거 D형 플립플롭

지금 주문
데이터시트

SN74AHC16374

활성
데이터시트 지금 주문

제품 상세 정보

Number of channels 16 Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 16 Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Operating Range 2-V to 5.5-V VCC
  • 3-State Outputs Drive Bus Lines Directly
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Operating Range 2-V to 5.5-V VCC
  • 3-State Outputs Drive Bus Lines Directly
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AHC16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHC16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16374 is characterized for operation from -40°C to 85°C.

The 'AHC16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHC16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16374 is characterized for operation from -40°C to 85°C.

open-in-new 기타 D형 플립플롭 찾기
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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
74AC16374 활성 3상 출력을 지원하는 16비트 에지 트리거 D형 플립플롭 Shorter average propagation delay (7ns), higher average drive strength (24mA)
비교 대상 장치와 유사한 기능
SN74AHC374 활성 3상 출력을 지원하는 8진 에지 트리거 D형 플립플롭 Voltage range (2V to 5.5V), average drive strength (9mA), average propagation delay (12ns)

기술 문서

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모두 보기21
유형 직함 날짜
* Data sheet 16-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet (Rev. G) 2000/01/25
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 2002/12/02
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 2000/02/24
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 1998/04/01
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Live Insertion 1996/10/01

설계 및 개발

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패키지 핀 다운로드
SSOP (DL) 48 옵션 보기
TSSOP (DGG) 48 옵션 보기
TVSOP (DGV) 48 옵션 보기
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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