SN74AS885
- Latchable P-Input Ports With Power-Up Clear
- Choice of Logical or Arithmetic
(Two's Complement) Comparison - Data and PLE Inputs Utilize pnp Input Transistors to Reduce dc Loading Effects
- Approximately 35% Improvement in
ac Performance Over Schottky TTL While Performing More Functions - Cascadable to n Bits While Maintaining High Performance
- 10% Less Power Than STTL for an 8-Bit Comparison
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs
These advanced Schottky devices are capable of performing high-speed arithmetic or logic comparisons on two 8-bit binary or two's complement words. Two fully decoded decisions about words P and Q are externally available at two outputs. These devices are fully expandable to any number of bits without external gates. To compare words of longer lengths, the P > QOUT and P < QOUT outputs of a stage handling less significant bits can be connected to the P > QIN and P < QIN inputs of the next stage handling more significant bits. The cascading paths are implemented with only a two-gate-level delay to reduce overall comparison times for long words. Two alternative methods of cascading are shown in application information.
The latch is transparent when P latch-enable (PLE) input is high;
the P-input port is latched
when PLE is low. This provides the designer with temporary storage for the P-data word. The enable circuitry is implemented with minimal delay times to enhance performance when cascaded for longer words. The PLE, P, and Q data inputs utilize pnp input transistors to reduce the low-level current input requirement to typically -0.25 mA, which minimizes dc loading effects.
The SN54AS885 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AS885 is characterized for operation from 0°C to 70°C.
In these cases, P > QOUT follows P > QIN and P < QOUT follows P < QIN.
AG = arithmetically greater than
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 8-Bit Magnitude Comparators datasheet (Rev. A) | 1995/01/01 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Advanced Schottky Load Management | 1997/02/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 | ||
| Application note | Advanced Schottky (ALS and AS) Logic Families | 1995/08/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| SOIC (DW) | 24 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치