홈 로직 및 전압 변환 플립플롭, 래치 및 레지스터 D형 플립플롭
홈
로직 및 전압 변환
플립플롭, 래치 및 레지스터
D형 플립플롭

SN74LVC1G374-Q1

활성

3상 출력을 지원하는 오토모티브 카탈로그 단일 D형 플립플롭

지금 주문
데이터시트

SN74LVC1G374-Q1

활성
데이터시트 지금 주문

제품 상세 정보

Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Automotive
Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Automotive
SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1
  • Qualified for Automotive Applications
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Partial-Power-Down Mode
    Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78,
    Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Qualified for Automotive Applications
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Partial-Power-Down Mode
    Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78,
    Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G374 features a 3-state output designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, input/output (I/O) ports, bidirectional bus drivers, and working registers.

On the positive transition of the clock (CLK) input, the Q output is set to the logic level set up at the data (D) input.

A buffered output-enable (OE) input can be used to place the output in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the output neither loads nor drives the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.

OE does not affect the internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G374 features a 3-state output designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, input/output (I/O) ports, bidirectional bus drivers, and working registers.

On the positive transition of the clock (CLK) input, the Q output is set to the logic level set up at the data (D) input.

A buffered output-enable (OE) input can be used to place the output in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the output neither loads nor drives the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.

OE does not affect the internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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기술 문서

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모두 보기29
유형 직함 날짜
* Data sheet Single D-Type Flip-Flop With 3-State Output datasheet (Rev. B) 2013/05/05
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
More literature Automotive Logic Devices Brochure 2014/08/27
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 2003/11/06
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 2002/12/18
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 2002/03/27
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note LVC Characterization Information 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Design guide Low-Voltage Logic (LVC) Designer's Guide 1996/09/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

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평가 보드

5-8-LOGIC-EVM — 5핀~8핀 DCK, DCT, DCU, DRL 및 DBV 패키지용 일반 논리 평가 모듈

5~8핀 수의 DCK, DCT, DCU, DRL 또는 DBV 패키지가 있는 모든 디바이스를 지원하도록 설계된 유연한 EVM.
사용 설명서: PDF
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레퍼런스 디자인

TIDA-00580 — 오토모티브 인증, 16비트 회전식 직교 디코더 레퍼런스 디자인

People prefer to use knobs over touchscreens in many situations.  This solution minimizes the required connections to a microcontroller to monitor a rotary quadrature encoder's direction and distance of rotation.
Design guide: PDF
회로도: PDF
패키지 핀 다운로드
SOT-23 (DBV) 6 옵션 보기
SOT-SC70 (DCK) 6 옵션 보기
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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