제품 상세 정보

Function Memory interface Output frequency (max) (MHz) 500 Number of outputs 26 Output supply voltage (V) 2.5 Core supply voltage (V) 2.5 Features DDR register Operating temperature range (°C) 0 to 70 Rating Military Output type SSTL-18 Input type SSTL-18
Function Memory interface Output frequency (max) (MHz) 500 Number of outputs 26 Output supply voltage (V) 2.5 Core supply voltage (V) 2.5 Features DDR register Operating temperature range (°C) 0 to 70 Rating Military Output type SSTL-18 Input type SSTL-18
TSSOP (DGG) 64 137.7 mm² 17 x 8.1 VQFNP (RGQ) 56 64 mm² 8 x 8
  • Member of the Texas Instruments Widebus™ Family
  • Operates at 2.3 V to 2.7 V for PC1600, PC2100, and PC2700
  • Operates at 2.5 V to 2.7 V for PC3200 (QFN Package)
  • Pinout and Functionality Compatible With JEDEC Standard SSTV16859
  • 600 ps Faster (Simultaneous Switching) Than the JEDEC Standard SSTV16859 in PC2700 DIMM Applications
  • 1-to-2 Outputs to Support Stacked DDR DIMMs
  • Output Edge-Control Circuitry Minimizes Switching Noise in an Unterminated Line
  • Outputs Meet SSTL_2 Class I Specifications
  • Supports SSTL_2 Data Inputs
  • Differential Clock (CLK and CLK\) Inputs
  • Supports LVCMOS Switching Levels on the RESET\ Input
  • RESET\ Input Disables Differential Input Receivers, Resets All Registers, and Forces All Outputs Low
  • Pinout Optimizes DIMM PCB Layout
  • Latch-Up Performance Exceeds 100mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Widebus is a trademark of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • Operates at 2.3 V to 2.7 V for PC1600, PC2100, and PC2700
  • Operates at 2.5 V to 2.7 V for PC3200 (QFN Package)
  • Pinout and Functionality Compatible With JEDEC Standard SSTV16859
  • 600 ps Faster (Simultaneous Switching) Than the JEDEC Standard SSTV16859 in PC2700 DIMM Applications
  • 1-to-2 Outputs to Support Stacked DDR DIMMs
  • Output Edge-Control Circuitry Minimizes Switching Noise in an Unterminated Line
  • Outputs Meet SSTL_2 Class I Specifications
  • Supports SSTL_2 Data Inputs
  • Differential Clock (CLK and CLK\) Inputs
  • Supports LVCMOS Switching Levels on the RESET\ Input
  • RESET\ Input Disables Differential Input Receivers, Resets All Registers, and Forces All Outputs Low
  • Pinout Optimizes DIMM PCB Layout
  • Latch-Up Performance Exceeds 100mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Widebus is a trademark of Texas Instruments.

This 13-bit to 26-bit registered buffer is designed for 2.3-V to 2.7-V VCC operation.

All inputs are SSTL_2, except the LVCMOS reset (RESET)\ input. All outputs are edge-controlled LVCMOS circuits optimized for unterminated DIMM loads.

The SN74SSTVF16859 operates from a differential clock (CLK and CLK\). Data are registered at the crossing of CLK going high and CLK\ going low.

The device supports low-power standby operation. When RESET\ is low, the differential input receivers are disabled, and undriven (floating) data, clock, and reference voltage (VREF) inputs are allowed. In addition, when RESET\ is low, all registers are reset and all outputs are forced low. The LVCMOS RESET\ input always must be held at a valid logic high or low level.

To ensure defined outputs from the register before a stable clock has been supplied, RESET\ must be held in the low state during power up.

This 13-bit to 26-bit registered buffer is designed for 2.3-V to 2.7-V VCC operation.

All inputs are SSTL_2, except the LVCMOS reset (RESET)\ input. All outputs are edge-controlled LVCMOS circuits optimized for unterminated DIMM loads.

The SN74SSTVF16859 operates from a differential clock (CLK and CLK\). Data are registered at the crossing of CLK going high and CLK\ going low.

The device supports low-power standby operation. When RESET\ is low, the differential input receivers are disabled, and undriven (floating) data, clock, and reference voltage (VREF) inputs are allowed. In addition, when RESET\ is low, all registers are reset and all outputs are forced low. The LVCMOS RESET\ input always must be held at a valid logic high or low level.

To ensure defined outputs from the register before a stable clock has been supplied, RESET\ must be held in the low state during power up.

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기술 문서

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모두 보기12
유형 직함 날짜
* Data sheet SN74SSTVF16859 datasheet (Rev. B) 2004/01/30
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note 56-Pin Quad Flatpack No-Lead Logic Package 2003/02/07
Application note Application of the SN74SSTVF16857 in Planar PC2700 (DDR-333) RDIMMs 2003/01/10
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
More literature DIMM Module Solution 2002/06/13
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note Application of the SN74SSTV32852 in Stacked, Low-Profile (1U) PC-1600/2100 DIMMs 2001/11/07
Application note Low-Power Support Using Texas Instruments SN74SSTV16857 and SN74SSTV16859 2001/02/09

설계 및 개발

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시뮬레이션 모델

HSPICE Model of SN74SSTVF16859 (Rev. A)

SCEJ145A.ZIP (48 KB) - HSpice Model
시뮬레이션 모델

SN74SSTVF16859DGG IBIS Model

SCEM341.ZIP (18 KB) - IBIS Model
시뮬레이션 모델

SN74SSTVF16859RGQ IBIS Model

SCEM342.ZIP (18 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
패키지 다운로드
TSSOP (DGG) 64 옵션 보기
VQFNP (RGQ) 56 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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