TLK111
- Fully Pin Compatible with the TLK110 Device
- Low Power Consumption:
- Single Supply: <205mW PHY, 275mW with
Center Tap (Typical) - Dual Supplies: <126mW PHY, 200mW with
Center Tap (Typical)
- Single Supply: <205mW PHY, 275mW with
- Programmable Power Back Off to reduce PHY
power up to 20% in systems with shorter cables - IEEE 1588 SFD indication enables time stamping
by a controller or processor - Low deterministic latency supports IEEE1588
implementation - Cable Diagnostics
- Programmable Fast Link Down Modes, <10µs
reaction time - Variable I/O voltage range: 1.8V to 3.3V
- 3.3-V MAC Interface
- Fixed TX Clock to XI, with programmable phase
shift - Auto-MDIX for 10/100Mbs
- Energy Detection Mode
- 25 MHz Clock Out
- MII and RMII Capabilities
- IEEE 802.3u MII
- IEEE 802.3u Auto-Negotiation and Parallel
Detection - Error-Free 100Base-T Operation up to 150 Meters
Under Typical Conditions - Error-Free 10Base-T Operation up to 300 Meters
Under Typical Conditions - Serial Management Interface
- IEEE 802.3u ENDEC, 10Base-T
Transceivers and Filters - IEEE 802.3u PCS, 100Base-TX Transceivers
- IEEE 1149.1 JTAG
- Integrated ANSI X3.263 Compliant TP-PMD
Physical Sublayer with Adaptive Equalization and
Baseline Wander Compensation - Programmable LED Support Link, 10/100Mbs
Mode, Activity, and Collision Detect - 10/100Mbs Packet BIST (Built in Self Test)
- HBM ESD protection on RD± and TD± of 16kV
- 48-pin LQFP Package (7mm) × (7mm)
The TLK111 is a single-port Ethernet PHY for 10Base-T and 100Base TX signaling. This device integrates all the physical-layer functions needed to transmit and receive data on standard twisted-pair cables. The TLK111 supports the standard Media Independent Interface (MII) and Reduced Media Independent Interface (RMII) for direct connection to a Media Access Controller (MAC).
The TLK111 is designed for power-supply flexibility, and can operate with a single 3.3V power supply or with combinations of 3.3V and 1.55V power supplies for reduced power operation.
The TLK111 uses mixed-signal processing to perform equalization, data recovery, and error correction to achieve robust operation over CAT 5 twisted-pair wiring. This device not only meets the requirements of IEEE 802.3, but maintains high margins in terms of cross-talk and alien noise.
The TLK111 Ethernet PHY has a special Power Back Off mode to conserve power in systems with relatively short cables. This mode provides the flexibility to reduce system power when the system is not required to drive the standard IEEE 802.3 100m cable length, or the extended 150m, error-free cable reach of the TLK111. For more detail, see application note SLLA328.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TLK111 PHYTER Industrial Temperature 10/100Mbs Ethernet Physical Layer Transceiver datasheet (Rev. C) | PDF | HTML | 2014/11/10 |
Application note | Selection and specification of crystals for Texas Instruments ethernet physical | 2019/02/06 | ||
EVM User's guide | TLK111EVM User's Guide | 2014/07/04 | ||
User guide | TLK1xx Software GUI | 2013/08/15 | ||
EVM User's guide | TLK111 Customer EVM | 2013/08/13 | ||
Application note | TLK1XX Design & Layout Guide (Rev. A) | 2012/08/15 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ETHERNET-SW — 이더넷 PHY Linux 드라이버 및 툴
USB-2-MDIO 소프트웨어를 사용하면 디버그 및 프로토타이핑 중에 레지스터에 직접 액세스할 수 있습니다. 이 툴은 모든 TI 이더넷 PHY를 지원합니다.
드라이버 지원 활성화
"make menuconfig"로 커널 구성(또는 "make xconfig" 또는 "make nConfig" 사용)
Menuconfig 위치
// 부품 번호 기호와 (...)
USB-2-MDIO — USB-2-MDIO Tool v1.0
The USB-2-MDIO software tool lets Texas Instruments' Ethernet PHYs access the MDIO status and device control registers. The USB-2-MDIO tool includes a LaunchPad™ Development kit for TI's MSP430™ MCUs that is interfaced with a lightweight GUI. The (...)
지원되는 제품 및 하드웨어
제품
이더넷 PHY
하드웨어 개발
평가 보드
개발 키트
소프트웨어
드라이버 또는 라이브러리
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
패키지 | 핀 | 다운로드 |
---|---|---|
LQFP (PT) | 48 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치