제품 상세 정보

Local sensor accuracy (max) 2 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 2.7 Interface type I2C, SMBus Supply voltage (max) (V) 5.5 Features ALERT, NIST traceable Supply current (max) (µA) 85 Temp resolution (max) (Bits) 12 Remote channels (#) 0 Addresses 8 Rating Automotive
Local sensor accuracy (max) 2 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 2.7 Interface type I2C, SMBus Supply voltage (max) (V) 5.5 Features ALERT, NIST traceable Supply current (max) (µA) 85 Temp resolution (max) (Bits) 12 Remote channels (#) 0 Addresses 8 Rating Automotive
SOIC (D) 8 29.4 mm² 4.9 x 6 VSSOP (DGK) 8 14.7 mm² 3 x 4.9
  • AEC-Q100 Qualified with:
    • Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range
    • HBM ESD Classification Level 2
    • CDM ESD Classification Level C6
  • TMP175-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±2°C (Maximum) from –40°C to +125°C
  • TMP75-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±3°C (Maximum) from –40°C to +125°C
  • TMP175-Q1: 27 Addresses
  • TMP75-Q1: 8 Addresses, NIST Traceable
  • Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
  • Resolution: 9 to 12 Bits, User-Selectable
  • Low Quiescent Current: 50-µA, 0.1-µA Standby
  • Wide Supply Range: 2.7 V to 5.5 V
  • Small 8-Pin VSSOP and 8-Pin SOIC Packages
  • AEC-Q100 Qualified with:
    • Temperature Grade 1: –40°C to +125°C Ambient Operation Temperature Range
    • HBM ESD Classification Level 2
    • CDM ESD Classification Level C6
  • TMP175-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±2°C (Maximum) from –40°C to +125°C
  • TMP75-Q1 Accuracy:
    • ±1°C (Typical) from –40°C to +125°C
    • ±3°C (Maximum) from –40°C to +125°C
  • TMP175-Q1: 27 Addresses
  • TMP75-Q1: 8 Addresses, NIST Traceable
  • Digital Output: SMBus™, Two-Wire, and I2C Interface Compatibility
  • Resolution: 9 to 12 Bits, User-Selectable
  • Low Quiescent Current: 50-µA, 0.1-µA Standby
  • Wide Supply Range: 2.7 V to 5.5 V
  • Small 8-Pin VSSOP and 8-Pin SOIC Packages

The TMP75-Q1 and TMP175-Q1 devices are digital temperature sensors ideal for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit, analog-to-digital converter (ADC) offers resolutions down to 0.0625°C. The devices are available in the industry-standard, LM75, 8-pin SOIC and VSSOP footprint.

The TMP175-Q1 and TMP75-Q1 feature SMBus, two-wire, and I2C interface compatibility. The TMP175-Q1 device allows up to 27 devices on one bus. The TMP75-Q1 allows up to eight devices on one bus. The TMP175-Q1 and TMP75-Q1 both feature an SMBus alert function.

The TMP175-Q1 and TMP75-Q1 devices are ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The TMP75-Q1 production units are 100% tested against sensors that are NIST-traceable and are verified with equipment that are NIST-traceable through ISO/IEC 17025 accredited calibrations.

The TMP175-Q1 and TMP75-Q1 devices are specified for operation over the temperature range of –40°C to +125°C.

The TMP75-Q1 and TMP175-Q1 devices are digital temperature sensors ideal for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit, analog-to-digital converter (ADC) offers resolutions down to 0.0625°C. The devices are available in the industry-standard, LM75, 8-pin SOIC and VSSOP footprint.

The TMP175-Q1 and TMP75-Q1 feature SMBus, two-wire, and I2C interface compatibility. The TMP175-Q1 device allows up to 27 devices on one bus. The TMP75-Q1 allows up to eight devices on one bus. The TMP175-Q1 and TMP75-Q1 both feature an SMBus alert function.

The TMP175-Q1 and TMP75-Q1 devices are ideal for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. The TMP75-Q1 production units are 100% tested against sensors that are NIST-traceable and are verified with equipment that are NIST-traceable through ISO/IEC 17025 accredited calibrations.

The TMP175-Q1 and TMP75-Q1 devices are specified for operation over the temperature range of –40°C to +125°C.

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기술 문서

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모두 보기5
유형 직함 날짜
* Data sheet TMPx75-Q1 Automotive Grade Temperature Sensor With I2C and SMBus Interface in Industry-Standard LM75 Form Factor and Pinout datasheet PDF | HTML 2015/11/18
Application note LM75B and TMP1075 Industry-Standard Devices: Design Guidelines and Spec Comparison (Rev. A) PDF | HTML 2024/03/07
Application brief How to Protect Displays with the Latest Temperature Sensing Technology PDF | HTML 2021/07/26
Technical article How to maximize powertrain efficiency and reliability with high-accuracy temperatu PDF | HTML 2021/05/10
Application note Applying I2C-Compatible Temperature Sensors in Systems With Slow Clock Edges (Rev. A) 2013/05/06

설계 및 개발

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드라이버 또는 라이브러리

LM75SW-LINUX — I2C 온도 센서용 Linux 드라이버

The Linux driver support LM75 compatible Temperature Sensors. The Linux driver supports communication through the I2C bus and interfaces with the Hardware Monitoring sub-system.
Linux Mainline Status

Available in Linux Main line: Yes
Available through git.ti.com: N/A

Supported Devices:
  • LM75A
  • TMP100
  • TMP101
  • (...)
시뮬레이션 모델

TMP75 IBIS Model

SLOM202.ZIP (22 KB) - IBIS Model
패키지 다운로드
SOIC (D) 8 옵션 보기
VSSOP (DGK) 8 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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