인터페이스 PCIe, SAS 및 SATA IC

통합 PCI Express®(PCIe) 1:3 4포트 4레인 패킷 스위치

제품 상세 정보

Type Packet switch Protocols PCIe Applications PCIe Number of channels 4 Speed (max) (Gbps) 2.5 Supply voltage (V) 1.5, 3.3 Rating Catalog Operating temperature range (°C) -40 to 85
Type Packet switch Protocols PCIe Applications PCIe Number of channels 4 Speed (max) (Gbps) 2.5 Supply voltage (V) 1.5, 3.3 Rating Catalog Operating temperature range (°C) -40 to 85
NFBGA (NMH) 196 225 mm² 15 x 15
  • PCI Express Base Specification, Revision 1.1
  • PCI Express Card Electromechanical Specification, Revision 1.1
  • PCI-to-PCI Bridge Architecture Specification, Revision 1.1
  • PCI Bus Power Management Interface Specification, Revision 1.2
  • PCI Express Fanout Switch With One ×1 Upstream Port and
    Three ×1 Downstream Ports
  • Packet Transmission Starts While Reception Still in Progress (Cut-Through)
  • 256-Byte Maximum Data Payload Size
  • Peer-to-Peer Support
  • Wake Event and Beacon Support
  • Support for D1, D2, D3hot, and D3cold
  • Active State Power Management (ASPM) Using Both L0s and L1
  • Low-Power PCI Express Transmitter Mode
  • Integrated AUX Power Switch Drains VAUX Power Only When Main Power Is Off
  • Integrated PCI Hot Plug Support
  • Integrated REFCLK Buffers for Switch Downstream Ports
  • 3.3-V Multifunction I/O Pins for PCI Hot Plug Status and Control
    or General Purpose I/Os
  • Optional Serial EEPROM for System-Specific Configuration Register
    Initialization

PCI Express, PCI Hot Plug are trademarks of others.

  • PCI Express Base Specification, Revision 1.1
  • PCI Express Card Electromechanical Specification, Revision 1.1
  • PCI-to-PCI Bridge Architecture Specification, Revision 1.1
  • PCI Bus Power Management Interface Specification, Revision 1.2
  • PCI Express Fanout Switch With One ×1 Upstream Port and
    Three ×1 Downstream Ports
  • Packet Transmission Starts While Reception Still in Progress (Cut-Through)
  • 256-Byte Maximum Data Payload Size
  • Peer-to-Peer Support
  • Wake Event and Beacon Support
  • Support for D1, D2, D3hot, and D3cold
  • Active State Power Management (ASPM) Using Both L0s and L1
  • Low-Power PCI Express Transmitter Mode
  • Integrated AUX Power Switch Drains VAUX Power Only When Main Power Is Off
  • Integrated PCI Hot Plug Support
  • Integrated REFCLK Buffers for Switch Downstream Ports
  • 3.3-V Multifunction I/O Pins for PCI Hot Plug Status and Control
    or General Purpose I/Os
  • Optional Serial EEPROM for System-Specific Configuration Register
    Initialization

PCI Express, PCI Hot Plug are trademarks of others.

The Texas Instruments XIO3130 switch is a PCI Express ×1 3-port fanout switch. The XIO3130 provides a single ×1 upstream port supporting full 250-MB/s packet throughput in each direction simultaneously. Three independently configurable ×1 downstream ports are provided that also support full 250-MB/s packet throughput in each direction simultaneously.

A cut-through architecture is implemented to reduce the latency associated with packets moving through the PCI Express fabric. As soon as the address or routing information is decoded within the header of a packet entering an ingress port, the packet is directed to the egress port for forwarding. Packet poisoning using the EDB framing signal is supported in circumstances where packet errors are detected after the transmission of the egress packet begins.

The downstream ports may be configured to support PCI Hot Plug slot implementations. In this scenario, the system designer may decide to use the integrated PCI Hot Plug-compliant controller. This feature is available through the classic PCI configuration space under the PCI Express Capability Structure. When enabled, the downstream ports provide the PCI Hot Plug standard mechanism to apply and remove power to the slot or socket.

Power-management features include Active State Power Management, PME mechanisms, the Beacon/Wake protocol, and all conventional PCI D-states. When ASPM is enabled, each link automatically saves power when idle using the L0s and L1 states. PME messages are supported along with the PME_Turn_Off/PME_TO_Ack protocol.

When enabled, the upstream port supports Beacon transmission as well as the WAKE side band signal to wake the system as the result of a PCI Hot Plug event. Furthermore, the downstream ports may be configured to detect Beacon from downstream devices and forward this upstream. The switch also supports the translation and forwarding of WAKE from a downstream device into Beacon on the upstream port for cabled implementations.

The Texas Instruments XIO3130 switch is a PCI Express ×1 3-port fanout switch. The XIO3130 provides a single ×1 upstream port supporting full 250-MB/s packet throughput in each direction simultaneously. Three independently configurable ×1 downstream ports are provided that also support full 250-MB/s packet throughput in each direction simultaneously.

A cut-through architecture is implemented to reduce the latency associated with packets moving through the PCI Express fabric. As soon as the address or routing information is decoded within the header of a packet entering an ingress port, the packet is directed to the egress port for forwarding. Packet poisoning using the EDB framing signal is supported in circumstances where packet errors are detected after the transmission of the egress packet begins.

The downstream ports may be configured to support PCI Hot Plug slot implementations. In this scenario, the system designer may decide to use the integrated PCI Hot Plug-compliant controller. This feature is available through the classic PCI configuration space under the PCI Express Capability Structure. When enabled, the downstream ports provide the PCI Hot Plug standard mechanism to apply and remove power to the slot or socket.

Power-management features include Active State Power Management, PME mechanisms, the Beacon/Wake protocol, and all conventional PCI D-states. When ASPM is enabled, each link automatically saves power when idle using the L0s and L1 states. PME messages are supported along with the PME_Turn_Off/PME_TO_Ack protocol.

When enabled, the upstream port supports Beacon transmission as well as the WAKE side band signal to wake the system as the result of a PCI Hot Plug event. Furthermore, the downstream ports may be configured to detect Beacon from downstream devices and forward this upstream. The switch also supports the translation and forwarding of WAKE from a downstream device into Beacon on the upstream port for cabled implementations.

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기술 문서

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모두 보기5
유형 직함 날짜
* Data sheet XIO3130 Data Manual datasheet (Rev. F) 2010/01/18
* Errata PCI Express Packet Switch Silicon Errata List (Rev. A) 2013/05/14
* User guide HSSC MicroStar BGA Discontinued and Redesigned 2022/05/08
Application note XIO3130 Implementation Guide (Rev. A) 2012/05/03
Product overview PCI Express Switch XIO3130 Quick Reference Card (Rev. B) 2008/05/16

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

XIO3130EVM — XIO3130EVM 평가 모듈

The Texas Instruments XIO3130 EVM is a functional implementation of a four-port PCIe-to-PCIe switch. The XIO3130 EVM was designed to allow validation of three separate functional modes. In normal mode the EVM is configures as a generic PCI Express switch. In Hot Plug modedownstream ports 1 and 2 (...)

사용 설명서: PDF
TI.com에서 구매할 수 없습니다
시뮬레이션 모델

XIO3130 IBIS Model

SLLM264.ZIP (72 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
시뮬레이션 툴

TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
사용 설명서: PDF
패키지 다운로드
NFBGA (NMH) 196 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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